NSEC53T032-ITJ

$46.38

Description：IC FLASH 256GBIT EMMC 153FBGA
Series：NSEC
Mfr：Insignis Technology Corporation
Package：Tray

SKU:c350ec8fcdc2 Category: Memory IC Brand: Insignis Technology Corporation

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Product introduction

NSEC53T032-ITJ is listed in the Memory IC range at ChipApex. The manufacturer field lists Insignis Technology Corporation. Its product description is IC FLASH 256GBIT EMMC 153FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for NSEC53T032-ITJ

Description：IC FLASH 256GBIT EMMC 153FBGA
Series：NSEC
Mfr：Insignis Technology Corporation
Package：Tray
Memory Type：Non-Volatile
Memory Format：FLASH
Technology：FLASH - NAND (pSLC)
Memory Size：256Gbit
Memory Organization：32G x 8
Memory Interface：eMMC_5.1
Clock Frequency：200 MHz
Write Cycle Time - Word, Page：-
Voltage - Supply：2.7V ~ 3.6V
Operating Temperature：-40°C ~ 85°C (TA)
Mounting Type：Surface Mount
Package / Case：153-VFBGA
Supplier Device Package：153-FBGA (11.5x13)
Access Time：-
Grade：-
Qualification：-

Memory IC datasheet and documents for NSEC53T032-ITJ

NSEC53T032-ITJ

Memory IC Overview

The NSEC53T032-ITJ is a 32GB eMMC memory IC manufactured by Insignis Technology Corporation. It utilizes 3D TLC technology with pSLC mode and operates within an industrial temperature range of -40°C to 85°C. The device features a VCC supply voltage of 3.3V and supports VCCQ levels of 1.8V or 3.3V. It is housed in a 153-ball FBGA package, providing high-density storage for demanding applications.

Memory IC Feature Summary

Industrial-grade reliability with extended temperature tolerance
High-density 3D NAND flash architecture
Flexible voltage interface support

Memory IC Applications

Automotive infotainment systems
Industrial control units
Embedded consumer electronics

Memory IC Procurement Notes

Verify the specific suffix 'J' against official datasheets to confirm package dimensions and pinout compatibility. Ensure that the required VCCQ voltage level (1.8V or 3.3V) matches the target system design constraints before procurement.

Memory IC Selection Notes

Select this component when industrial temperature stability and high storage density are required. Consider the 153-ball FBGA footprint for PCB layout planning. Verify that the host controller supports the eMMC 5.0 standard for optimal performance integration.

Memory IC Part Context

This part belongs to the NSEC series from Insignis Technology Corporation, a fabless memory manufacturer specializing in DRAM and NAND solutions. The series targets robust embedded storage needs across various sectors.