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The NSVTB60BDW1T1G is a dual-component semiconductor device integrating a PNP general-purpose transistor and an NPN bias resistor transistor within a single SOT-363 package. The PNP section (Q1) supports a maximum collector-emitter voltage of -50 Vdc and continuous collector current of -150 mAdc, with a DC current gain ranging from 120 to 560 at -5.0 mA. The NPN section (Q2) features a 50 Vdc collector-emitter breakdown voltage and includes monolithic bias resistors R1 and R2, providing an input resistance of approximately 22 kΩ. Total device power dissipation reaches 250 mW at 25°C ambient temperature.
Verify the specific ordering suffix against official documentation to confirm packaging orientation and tape specifications. Confirm that the NSV prefix aligns with project requirements for automotive-grade components subject to unique site controls. Ensure compliance with Pb-Free and RoHS standards as stated in the datasheet before finalizing procurement orders.
Select this component when a design requires both a standard PNP switching element and an NPN transistor with built-in biasing in a limited footprint. Evaluate the thermal resistance characteristics under actual PCB pad configurations, as total device dissipation varies significantly between minimum pad and full FR-4 pad layouts. Verify that the required current gain ranges for both transistors meet the specific application thresholds.
This part belongs to onsemi's portfolio of dual-transistor combinations designed to replace multiple discrete components. It utilizes the SOT-363 (SC-88) surface-mount technology to provide high-density integration. The device serves as a solution for mixed-signal applications where space constraints necessitate combining general-purpose bipolar junction transistors with digital bias resistor transistors.
NSVTB60BDW1T1G