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NTG05-008L is listed in the Inrush Current Limiters (ICL) range at ChipApex. The manufacturer field lists YAGEO. Its product description is ICL 8 OHM 15% 5A 13MM. Review the specifications below when checking this part for your BOM.
The YAGEO NTG05-008L is a Negative Temperature Coefficient (NTC) thermistor designed as an inrush current limiter. It features a nominal resistance of 8 Ohms with a tolerance of ±15%. The component supports a continuous current rating of 5 A and operates within a temperature range of -40°C to +125°C. Its physical dimensions include a diameter of 13 mm and a lead spacing of 7.5 mm, utilizing a radial package for PCB mounting.
Verify the specific datasheet version from YAGEO to confirm exact thermal characteristics and maximum energy absorption ratings. Ensure the selected variant matches the required lead spacing and voltage ratings for the target application environment. Cross-reference official documentation for any updates regarding RoHS compliance or packaging specifications before finalizing procurement orders.
Select this component based on the required steady-state current capacity and initial resistance value. Evaluate the peak inrush current magnitude of the target circuit to ensure the thermistor can handle the thermal stress without permanent damage. Consider the ambient operating temperature range and available board space for the 13 mm diameter footprint when designing the layout.
This part belongs to YAGEO's NTC thermistor portfolio, specifically categorized under inrush current limiters. These components are engineered to protect sensitive electronic circuits from high initial charging currents. The product line offers various resistance values and physical sizes to accommodate different power levels and form factor constraints in industrial and consumer electronics.
Consult official YAGEO documentation for verified substitute part numbers within the same series. Ensure any alternative component matches the 8 Ohm resistance, 5 A current rating, and 13 mm diameter specifications. Verify compatibility with existing PCB footprints and thermal management requirements before implementation.
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