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The NTSJ3080CTG is a dual common cathode trench-based Schottky rectifier from onsemi, rated for 80 V reverse voltage and 15 A average forward current per diode. It utilizes fine lithography technology to achieve exceptionally low forward voltage (0.455 V typ at 5 A) and low leakage current. The device operates within a junction temperature range of -40°C to +150°C and features a TO-220FP package with a thermal resistance of 4.0 °C/W junction-to-case.
Verify the specific ordering suffix 'G' confirms the Pb-Free package status as documented in the datasheet. Ensure the procurement matches the TO-220FP mechanical dimensions and lead solderability requirements specified by the manufacturer. Confirm compliance with UL 94-0 flammability ratings for the epoxy molding compound before final integration.
Select this component for designs requiring high efficiency and low thermal dissipation in medium-current applications. The dual common cathode configuration simplifies circuit topology for freewheeling or OR-ing functions. Evaluate the 80 V rating against system peak reverse voltages to ensure adequate margin under transient conditions.
This part belongs to onsemi's Very Low Forward Voltage Trench-based Schottky Rectifier series. It is designed to replace standard silicon rectifiers in applications demanding higher efficiency and reduced heat generation. The product line targets modern power conversion systems where regulatory compliance and thermal management are critical design constraints.
Datasheets list NTSJ3080CT/D as a related publication order number. Verify electrical equivalence and package compatibility when considering cross-references. No other direct substitute part numbers are confirmed in the provided documentation.
The maximum nonrepetitive peak surge current is 160 A, applied at rated load conditions with a half-wave, single phase, 60 Hz surge.
The typical instantaneous forward voltage decreases as temperature increases; for example, it drops from 0.516 V at 25°C to 0.455 V at 125°C at an IF of 5 A.
The maximum thermal resistance from junction to case is 4.0 °C/W when insertion mounted to a 1 oz FR4 board.