NX3L2267GM,132

$0.42

Description：IC SWITCH SPDTX2 750MOHM 10XQFN
Series：-

SKU:e0aa31d22604 Category: Analog Switches, Multiplexers, Demultiplexers Brand: NXP USA Inc.

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Product introduction

Product Detailed Parameters

Description：IC SWITCH SPDTX2 750MOHM 10XQFN
Series：-
Mfr：NXP USA Inc.
Package：Tape & Reel (TR),Cut Tape (CT)
Switch Circuit：SPDT
Multiplexer/Demultiplexer Circuit：2:01
On-State Resistance (Max)：750mOhm
Channel-to-Channel Matching (ΔRon)：90mOhm
Voltage - Supply, Single (V+)：1.4V ~ 4.3V
Voltage - Supply, Dual (V±)：-
Switch Time (Ton, Toff) (Max)：40ns, 20ns
-3db Bandwidth：60MHz
Charge Injection：37pC
Channel Capacitance (CS(off), CD(off))：35pF
Current - Leakage (IS(off)) (Max)：10nA
Crosstalk：-90dB @ 100kHz
Operating Temperature：-40°C ~ 125°C (TA)
Mounting Type：Surface Mount
Package / Case：10-XFQFN
Supplier Device Package：10-XQFN (1.55x2)
Number of Circuits：2
Grade：-
Qualification：-

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NX3L2267GM,132

Overview

The NX3L2267GM,132 is a dual low-ohmic single-pole double-throw analog switch manufactured by NXP USA Inc. It operates within a supply voltage range of 1.4 V to 4.3 V and supports an ambient temperature range from -40 °C to +125 °C. The device features Schmitt trigger inputs for noise immunity and allows signals up to VCC amplitude. Key electrical parameters include a typical ON resistance of 0.5 Ω at 2.7 V and 4.3 V, with a maximum peak resistance of 0.9 Ω in the specified temperature range. It provides high current handling capability of 350 mA continuous current under a 3.3 V supply.

Feature Summary

Dual SPDT analog switches suitable for 2:1 multiplexer/demultiplexer applications
Low threshold digital inputs compatible with 1.8 V logic levels in 3.3 V applications
High ESD protection exceeding 7500 V (HBM) and 6000 V (IEC61000-4-2 contact discharge)
Break-before-make switching action ensures minimal signal distortion

Applications

Cell phones
Personal Digital Assistants (PDA)
Portable media players

Procurement Notes

Verify the specific ordering suffix against official documentation to confirm package type and temperature rating. Confirm RoHS compliance status and REACH registration details prior to procurement. Ensure the selected variant matches the required thermal dissipation characteristics for the intended operating environment.

Selection Notes

Select this component when designing circuits requiring low signal attenuation and high current handling in portable devices. Verify that the control logic voltage levels align with the device's input thresholds. Consider the XQFN10 package dimensions for PCB layout constraints and ensure adequate thermal management for power dissipation limits.

Part Context

This part belongs to the NX3L2267 family of low-ohmic analog switches. The GM suffix indicates the XQFN10 plastic extremely thin quad flat package (SOT1049-3). Other variants in the series include the GU version with different body dimensions. The device is designed for general-purpose signal routing in consumer electronics.