NXQ1TXA5/505J

Overview

The NXQ1TXA5/505J is a single-chip Qi-compliant wireless power transmitter IC designed for low-power applications. It supports supply voltages ranging from 3.5V to 5.25V with a typical supply current of 2mA. The component is housed in a 32-HVQFN (5x5) package with an exposed pad, suitable for surface-mount assembly. This device integrates the necessary circuitry to generate and modulate the magnetic field required for inductive power transfer according to the Wireless Power Consortium specifications.

Feature Summary

• Qi-compliant transmitter design for standardized wireless charging
• Single-chip integration reduces external component count
• Optimized for low-power efficiency applications

Applications

• Wireless power transmitters
• Low-power Qi charging bases
• Consumer electronics charging stations

Procurement Notes

Verify product status as obsolete before procurement planning. Confirm packaging details such as reel or cut tape availability through authorized distributors. Ensure compatibility with existing board designs given the specific HVQFN32 footprint. Check for RoHS compliance documentation if required by regulatory standards.

Selection Notes

Select this component for designs requiring a compact, single-chip solution for Qi-based wireless charging. Consider the 3.5V to 5.25V input range when designing the power supply stage. Evaluate the thermal performance associated with the exposed pad HVQFN package for heat dissipation requirements in the final enclosure.

Part Context

This part belongs to NXP's Greenchip portfolio, representing optimized power solutions released around 2014. It serves as a foundational component for reference designs targeting the WPC 1.1 Qi specification. The series focuses on providing world-class performance for power-efficient wireless charging implementations in consumer devices.

Replacement Considerations

No public confirmed substitute part numbers are available in the provided data. As the product status is listed as obsolete, alternative components must be sourced based on functional equivalence and pin compatibility rather than direct manufacturer substitution lists.