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The OMAP3530DZCBBA is a HiRel applications processor based on the enhanced OMAP3 architecture, manufactured using 65-nm CMOS technology. It integrates an ARM Cortex-A8 core operating up to 600 MHz and a TMS320C64x+ DSP core running at 520 MHz. The device features a POWERVR SGX graphics accelerator, IVA2.2 subsystem, and extensive memory including 112 KB ROM and 64 KB L2 RAM. It supports Linux and Windows CE, offers SmartReflex adaptive voltage control, and utilizes a 515-pin s-PBGA package with Package-on-Package memory stacking capability.
Verify the specific suffix 'D' against the official Texas Instruments datasheet SPRS599D to confirm temperature grade and availability status. Confirm that the 515-pin s-PBGA package matches the required board layout constraints. Ensure compatibility with the intended operating system environment, such as Linux or Windows CE, prior to integration.
Select this component when high reliability and extended temperature performance are required for multimedia processing. The CBB suffix indicates a 515-pin package supporting both POP memory stacking and discrete memory interfaces. Verify that the design accommodates the specific ball pitch dimensions and multiplexed I/O requirements defined in the terminal description section of the datasheet.
This part belongs to the OMAP3530-HiRel series, designed for robust multimedia applications. It shares the core architecture with commercial OMAP3530 devices but includes enhancements for reliability. The device is distinct from the OMAP3525-HiRel, which lacks the POWERVR SGX graphics subsystem found in the 3530 variant.
OMAP3525EZCBC