OMAP3530ECBBLPD

OMAP3530ECBBLPD

$34.92
  • Description:IC MPU OMAP-35XX 600MHZ 515FCBGA
  • Series:OMAP-35xx
  • Mfr:Texas Instruments
  • Package:Tray

SKU:7b7fc0d32313 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC MPU OMAP-35XX 600MHZ 515FCBGA
  • Series:OMAP-35xx
  • Mfr:Texas Instruments
  • Package:Tray
  • Core Processor:ARM® Cortex®-A8
  • Number of Cores/Bus Width:1 Core, 32-Bit
  • Speed:600MHz
  • Co-Processors/DSP:Signal Processing; C64x+, Multimedia; NEON™ SIMD
  • RAM Controllers:LPDDR
  • Graphics Acceleration:Yes
  • Display & Interface Controllers:LCD
  • Ethernet:-
  • SATA:-
  • USB:USB 1.x (3), USB 2.0 (1)
  • Voltage - I/O:1.8V, 3.0V
  • Operating Temperature:0°C ~ 90°C (TJ)
  • Security Features:-
  • Mounting Type:Surface Mount
  • Package / Case:515-VFBGA, FCBGA
  • Supplier Device Package:515-POP-FCBGA (12x12)
  • Additional Interfaces:HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART
  • Grade:-
  • Qualification:-

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OMAP3530ECBBLPD

Overview

The OMAP3530ECBBLPD is a microprocessor from the Texas Instruments OMAP-35xx series, featuring an ARM Cortex-A8 core and a TMS320C64x+ DSP. It operates at a maximum clock frequency of 600 MHz for the ARM core and 600 MHz for the DSP. The device utilizes a 515-POP-FCBGA package with a 12x12 mm footprint. It supports LPDDR RAM controllers and includes L1/L2 cache, ROM, and SRAM storage types. Operating temperatures range from -40°C to +105°C, with I/O voltages of 1.8V and 3.0V.

Feature Summary

  • Integrates dual-core architecture combining ARM Cortex-A8 and TMS320C64x+ DSP for multimedia and signal processing tasks.
  • Supports NEON SIMD technology for enhanced multimedia performance.
  • Includes dedicated graphics acceleration capabilities.
  • Features multiple interface options including USB, UART, I2C, and MMC/SD/SDIO.

Applications

  • Audio applications
  • Digital media processing
  • Portable consumer electronics

Procurement Notes

Verify the specific suffix BBLPD against official datasheets to confirm package type and temperature range. Confirm RoHS compliance status as per current manufacturer documentation. Check for any recent PCN updates regarding assembly or sourcing changes. Ensure compatibility with existing board designs regarding the 515-POP-FCBGA footprint and voltage requirements.

Selection Notes

Select this component when a dual-core solution with both application processing and digital signal processing is required. Consider the 600 MHz operating speed and NEON support for multimedia-intensive workloads. Verify that the system design accommodates the 515-pin FCBGA package and the specified thermal operating range. Ensure power supply rails match the 985 mV to 1.35 V core voltage and 1.8V/3.0V I/O requirements.

Part Context

This part belongs to the OMAP35xx family, designed for high-performance embedded applications. It shares architectural similarities with other OMAP3530 variants but differs in packaging and environmental specifications. The series is known for integrating ARM and DSP cores on a single die, targeting mobile and industrial markets requiring efficient multimedia handling.

FAQ

What is the maximum operating temperature for the OMAP3530ECBBLPD?

The maximum junction temperature (TJ) is specified as 105°C.

Does this processor include hardware graphics acceleration?

Yes, the OMAP3530ECBBLPD includes graphics acceleration capabilities.

OMAP3530ECBBLPDOMAP3530ECBBLPD
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