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The OMAP3530ECBBLPD is a microprocessor from the Texas Instruments OMAP-35xx series, featuring an ARM Cortex-A8 core and a TMS320C64x+ DSP. It operates at a maximum clock frequency of 600 MHz for the ARM core and 600 MHz for the DSP. The device utilizes a 515-POP-FCBGA package with a 12x12 mm footprint. It supports LPDDR RAM controllers and includes L1/L2 cache, ROM, and SRAM storage types. Operating temperatures range from -40°C to +105°C, with I/O voltages of 1.8V and 3.0V.
Verify the specific suffix BBLPD against official datasheets to confirm package type and temperature range. Confirm RoHS compliance status as per current manufacturer documentation. Check for any recent PCN updates regarding assembly or sourcing changes. Ensure compatibility with existing board designs regarding the 515-POP-FCBGA footprint and voltage requirements.
Select this component when a dual-core solution with both application processing and digital signal processing is required. Consider the 600 MHz operating speed and NEON support for multimedia-intensive workloads. Verify that the system design accommodates the 515-pin FCBGA package and the specified thermal operating range. Ensure power supply rails match the 985 mV to 1.35 V core voltage and 1.8V/3.0V I/O requirements.
This part belongs to the OMAP35xx family, designed for high-performance embedded applications. It shares architectural similarities with other OMAP3530 variants but differs in packaging and environmental specifications. The series is known for integrating ARM and DSP cores on a single die, targeting mobile and industrial markets requiring efficient multimedia handling.
The maximum junction temperature (TJ) is specified as 105°C.
Yes, the OMAP3530ECBBLPD includes graphics acceleration capabilities.