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The Texas Instruments OMAP3530ECBC is a high-performance applications processor based on the enhanced OMAP architecture. It integrates an ARM Cortex-A8 core and a TMS320C64x+ DSP core within a single chip. The device supports a maximum clock frequency of 600 MHz for the ARM core and 600 MHz for the DSP. It features a 32-bit data bus width and includes L1/L2 cache, ROM, and SRAM storage types. Operating voltage ranges from 985 mV to 1.35 V, with I/O voltage at 1.8 V. The component operates between -40°C and +105°C and utilizes a 515-POP-FCBGA package.
Verify the specific suffix 'ECBC' against official Texas Instruments documentation to confirm pinout and electrical characteristics, as variations exist within the OMAP35xx family. Ensure compatibility with required operating system BSPs such as Linux or Windows CE. Confirm moisture sensitivity level handling during assembly to prevent damage. Cross-reference the package type 515-POP-FCBGA with PCB design guidelines.
Select this component when dual-core performance is required for complex multimedia tasks. The combination of ARM and DSP cores allows for efficient offloading of signal processing duties. Consider thermal management solutions due to the 105°C maximum junction temperature rating. Verify that the 515-ball BGA package fits the available board space and routing constraints.
The OMAP3530 belongs to the OMAP-35xx series of applications processors designed by Texas Instruments. This series targets high-performance embedded systems requiring significant computational power for graphics and media processing. The ECBC variant specifies the commercial temperature range and specific packaging configuration within the broader OMAP3530 product line.
Public confirmed substitute part numbers are not available in the provided source material.