OMAPL137DZKB3

Microprocessors Overview

The OMAPL137DZKB3 is a microprocessor unit within the Texas Instruments OMAP-L1x series. It integrates an ARM926EJ-S core operating at 375MHz with a C674x DSP co-processor. The device utilizes a 256-BGA package measuring 17x17 mm. It supports SDRAM controllers and includes interfaces such as USB 1.1, USB 2.0, Ethernet, MMC/SD, SPI, UART, I2C, and McASP. Operating voltage levels are specified at 1.8V and 3.3V for I/O, with a junction temperature range of -40°C to 105°C.

Microprocessors Feature Summary

• Combines ARM926EJ-S application processor with C674x fixed/floating-point DSP for mixed-signal processing
• Integrates multiple high-speed communication peripherals including dual USB PHYs and 10/100Mbps Ethernet MAC
• Supports external SDRAM memory expansion via dedicated controller interface

Microprocessors Applications

• Industrial automation control systems requiring real-time signal processing
• Medical imaging equipment utilizing DSP capabilities for image enhancement
• Consumer electronics featuring LCD display interfaces and multimedia input/output

Microprocessors Procurement Notes

Verify the specific suffix A3 against the manufacturer datasheet to confirm pinout compatibility and electrical characteristics. Ensure the ordering part number matches the exact package dimensions and thermal requirements. Cross-reference the RoHS status and moisture sensitivity level with current project specifications before finalizing procurement orders.

Microprocessors Selection Notes

Select this component when both general-purpose computing and high-performance digital signal processing are required in a single chip. The integrated peripherals reduce board space compared to discrete solutions. Consider the 256-BGA package constraints for PCB layout and thermal management during the design phase.

Microprocessors Part Context

This part belongs to the OMAP-L1x family, designed for applications needing low power consumption alongside significant computational throughput. It bridges the gap between standard microcontrollers and complex system-on-chip solutions by providing a balanced architecture for embedded tasks.

Microprocessors Replacement Considerations

OMAPL137CZKB3 shares the same core architecture but differs in package type. Verify pin-to-pin compatibility and thermal performance differences before substituting.