OMAPL137DZKB4

$16.48

Description：IC MPU OMAP-L1X 456MHZ 256BGA
Series：OMAP-L1x
Mfr：Texas Instruments
Package：Tray

SKU:f2f8ea37053c Category: Microprocessors Brand: Texas Instruments

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Product introduction

OMAPL137DZKB4 is listed in the Microprocessors range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC MPU OMAP-L1X 456MHZ 256BGA. Review the specifications below when checking this part for your BOM.

Microprocessors specifications for OMAPL137DZKB4

Description：IC MPU OMAP-L1X 456MHZ 256BGA
Series：OMAP-L1x
Mfr：Texas Instruments
Package：Tray
Core Processor：ARM926EJ-S
Number of Cores/Bus Width：1 Core, 32-Bit
Speed：456MHz
Co-Processors/DSP：Signal Processing; C674x, System Control; CP15
RAM Controllers：SDRAM
Graphics Acceleration：No
Display & Interface Controllers：LCD
Ethernet：10/100Mbps (1)
SATA：-
USB：USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage - I/O：1.8V, 3.3V
Operating Temperature：0°C ~ 90°C (TJ)
Security Features：-
Mounting Type：Surface Mount
Package / Case：256-BGA
Supplier Device Package：256-BGA (17x17)
Additional Interfaces：HPI, I2C, McASP, MMC/SD, SPI, UART
Grade：-
Qualification：-

Microprocessors datasheet and documents for OMAPL137DZKB4

OMAPL137DZKB4

Microprocessors Overview

The OMAPL137DZKB4 is a microprocessor from the Texas Instruments OMAP-L1x series, integrating an ARM926EJ-S core and a C674x DSP co-processor. It operates at a maximum clock frequency of 456 MHz within a 256-BGA package measuring 17x17 mm. The device supports surface mount installation and functions within a junction temperature range of -40°C to 90°C. Power supply requirements include 1.8V and 3.3V I/O voltages. Key interfaces encompass Ethernet, USB 1.1 and 2.0 with PHYs, HPI, I2C, McASP, MMC/SD, SPI, and UART.

Microprocessors Feature Summary

Dual-core architecture combining ARM926EJ-S for system control and C674x for signal processing
Integrated memory controllers supporting SDRAM access
Comprehensive peripheral interface set including high-speed serial and multimedia ports

Microprocessors Applications

Industrial automation systems requiring real-time control
Multimedia gateways utilizing integrated Ethernet and USB capabilities
Embedded applications needing simultaneous ARM and DSP processing

Microprocessors Procurement Notes

Verify the specific suffix D4 against the official datasheet to confirm pinout compatibility and electrical characteristics. Ensure the design accounts for the 256-BGA thermal dissipation requirements. Confirm that the target application voltage levels align with the specified 1.8V and 3.3V I/O standards before integration.

Microprocessors Selection Notes

Select this component when both general-purpose processing and high-performance digital signal processing are required in a single chip. The OMAP-L1x series is suitable for designs needing extensive connectivity options like Ethernet and multiple serial interfaces. Consider the 456 MHz speed and BGA packaging constraints during PCB layout planning.

Microprocessors Part Context

This part belongs to the OMAP-L1x family, designed for applications demanding efficient power consumption alongside robust processing capabilities. The series integrates ARM and C6000 DSP cores to handle complex algorithms while managing system tasks. It targets embedded markets requiring multimedia processing and industrial control functionalities.