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OMAPL138AZCE3 is listed in the Microprocessors range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC MPU OMAP-L1X 300MHZ 361NFBGA. Review the specifications below when checking this part for your BOM.
The OMAPL138AZCE3 is a dual-core system-on-chip integrating an ARM926EJ-S RISC MPU and a C674x fixed- and floating-point VLIW DSP. It operates at frequencies up to 375 MHz with a 1.2V core voltage. The device features 16KB instruction cache, 16KB data cache, and 8KB vector RAM in the ARM subsystem, alongside 32KB L1P, 32KB L1D, and 256KB L2 unified cache in the DSP subsystem. It includes 128KB of shared RAM and supports DDR2/mDDR memory controllers via EMIFA. The package is a 361-ball NFBGA (ZCE) with a 0.65mm pitch.
Verify the specific speed grade and package variant against the datasheet specifications before procurement. Confirm that the ZCE package dimensions and ball pitch match the target PCB layout requirements. Ensure compatibility with the required operating temperature range for the intended application environment.
Select this component when a mixed-signal processor requiring both general-purpose OS execution and intensive DSP algorithms is needed. The integrated PRUSS offers hardware-level determinism for time-critical tasks without burdening the main cores. Consider the available on-chip memory hierarchy and external interface options for system design constraints.
This part belongs to the Texas Instruments OMAP-L138 family, designed as a low-power applications processor. It targets embedded systems requiring robust multimedia capabilities and industrial control features. The device bridges the gap between standard microprocessors and dedicated digital signal processors through its heterogeneous multi-core design.
OMAPL138EZCE3
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