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OPA128LM is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC OPAMP GP 1 CIRCUIT TO99-8. Review the specifications below when checking this part for your BOM.
The OPA128LM is a precision operational amplifier manufactured by Texas Instruments, housed in an 8-pin TO-99 metal can package designed for through-hole mounting. It features a single channel and operates on dual power supplies with typical voltages of ±9 V, ±12 V, and ±15 V. Key electrical parameters include a gain-bandwidth product of 1 MHz, a slew rate of 3 V/µs, and a voltage gain of 128 dB. The device exhibits a typical input voltage noise density of 92 nV/√Hz. It functions within a temperature range of 0°C to +70°C and measures 9.08 x 9.08 x 4.4 mm.
Verify the specific suffix 'LM' against the manufacturer's official datasheet to confirm pinout compatibility and package dimensions. Ensure the procurement specification matches the required operating temperature range of 0°C to +70°C. Confirm that the TO-99 through-hole package aligns with the target PCB layout requirements before finalizing orders.
Select this component when a single-channel precision amplifier with a metal can package is required. It is suitable for applications demanding low noise and high gain without rail-to-rail output capabilities. Verify that the system supports dual power supply configurations, as the device does not support single-supply operation.
This part belongs to the Texas Instruments OPA128 series of precision operational amplifiers. The series is engineered for applications requiring high accuracy and stability. The LM variant specifically denotes the through-hole TO-99 packaging option, distinguishing it from surface-mount equivalents within the same functional family.
Consult official substitution guides for compatible single-channel precision amplifiers in TO-99 packages. Verify that any alternative device maintains equivalent noise density, gain-bandwidth product, and package footprint specifications.
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