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OPA2335AIDGKR is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC OPAMP ZERO-DRIFT 2CIRC 8VSSOP. Review the specifications below when checking this part for your BOM.
The OPA2335AIDGKR is a dual, low-power, rail-to-rail input and output operational amplifier manufactured by Texas Instruments. It features a bandwidth of 1.4 MHz and a slew rate of 0.8 V/µs. The device operates from a single supply voltage ranging from 2.7 V to 5.5 V or dual supplies of ±1.35 V to ±2.75 V. Input offset voltage is typically 2 mV, with a maximum of 6 mV at room temperature. Quiescent current per channel is 350 µA. The component is housed in an SOT-23-8 package.
Verify the exact suffix 'DGKR' corresponds to the SOT-23-8 package and tape-and-reel quantity specified in the manufacturer's official documentation. Confirm that the 'A' grade designation matches the required offset voltage specifications for your design. Ensure compatibility with your PCB footprint and reflow soldering profile requirements before finalizing procurement orders.
Select this component when rail-to-rail performance is required alongside low power consumption. It is suitable for applications where supply voltages are limited to 5.5 V or less. Consider the 350 µA quiescent current per channel against system power budgets. Verify that the 1.4 MHz bandwidth meets the signal frequency requirements of the intended circuit application.
This part belongs to the OPAx335 family of precision, low-power operational amplifiers. The '2' indicates a dual-channel configuration within the package. The 'A' suffix denotes a specific grade of performance regarding input offset voltage and drift. The 'IDGKR' suffix specifies the industrial temperature range, SOT-23-8 package type, and reel packaging format.
Compatible substitutes include other members of the OPA33x family such as the OPA2333 or OPA2334, provided pinout and electrical specifications align. Verify that alternative devices maintain rail-to-rail input/output characteristics and similar power consumption levels. Check package compatibility to ensure direct replacement without PCB redesign.
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