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OPA2863AIDSNR is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is DUAL, HIGH-PRECISION, LOW-POWER,. Review the specifications below when checking this part for your BOM.
The OPA2863AIDSNR is a dual, high-precision, low-power operational amplifier from the OPAx863A family. It features a gain-bandwidth product of 50MHz and a slew rate of 100V/µs with rail-to-rail input and output capabilities. The device operates on supply voltages ranging from 2.7V to 12.6V. Key electrical specifications include a maximum input offset voltage of 95µV, an offset drift of 1.2µV/°C, and a quiescent current of 800µA per channel. It provides excellent harmonic distortion performance and includes overload power limiting and short-circuit protection.
Verify the specific package type DSN (USON, 10) matches your PCB footprint requirements. Confirm that the operating temperature range of –40°C to +125°C aligns with your environmental constraints. Ensure proper handling procedures are followed due to moisture sensitivity classification. Cross-reference the datasheet revision date to ensure compatibility with your design documentation.
Select this component when high DC accuracy is required alongside moderate bandwidth. The low offset voltage and drift make it suitable for precision signal conditioning. Consider the USON package size if board space is limited compared to standard SOIC or VSSOP options. Evaluate the power-down feature if system standby current reduction is necessary.
This part belongs to the OPAx863A series, which includes single (OPA863A) and dual (OPA2863A) variants. The 'A' suffix indicates high-precision trimming. The 'DSNR' suffix denotes the Dual channel configuration in a 10-pin USON package supplied in a reel format. Other packages available include SOIC-8 and VSSOP-8.
Direct pin-compatible replacements within the same family include OPA2863ADGKR (VSSOP-8) and OPA2863ADR (SOIC-8). Verify package dimensions and thermal characteristics when substituting between different package types.
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