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OPA843IDBVT is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC OPAMP VFB 1 CIRCUIT SOT23-5. Review the specifications below when checking this part for your BOM.
The OPA843IDBVT is a single-channel, high-speed voltage feedback operational amplifier manufactured by Texas Instruments. It features an 800 MHz gain-bandwidth product and a 1 kV/us slew rate, housed in a compact SOT-23-5 surface-mount package. The device operates on a supply voltage range of 4 V to 6 V with a typical quiescent current of 20.2 mA per channel. Key electrical specifications include a low input voltage noise density of 2 nV/√Hz, a maximum open-loop voltage gain of 110 dB, and a common-mode rejection ratio of 95 dB. It supports output currents up to 100 mA and functions reliably within an industrial temperature range from -40°C to +85°C.
Verify the specific suffix IDBVT to confirm the SOT-23-5 package and tape-and-reel delivery format. Ensure compatibility with the required 4 V to 6 V supply rails and check moisture sensitivity levels for proper handling during assembly. Confirm that the operating temperature range meets the environmental requirements of the target application.
Select this component when a balance of moderate bandwidth and low noise is required in a small form factor. It serves as a compact alternative to larger packages while maintaining high-speed performance. Consider the 20.2 mA quiescent current draw against power constraints and verify that the SOT-23-5 thermal dissipation capabilities are sufficient for the intended load conditions.
This part belongs to the OPA843 series of wideband, low-distortion voltage feedback amplifiers. It shares core electrical characteristics with other variants in the family but is distinguished by its specific SOT-23-5 packaging and reel-based distribution method. The series is designed for applications requiring high speed and precision in space-constrained designs.
The OPA843IDG4 is a pin-compatible alternative available in an SOIC-8 tube package. Verify that the change in physical dimensions and thermal properties does not impact the existing printed circuit board layout or heat dissipation strategy.
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