Microcontrollers, Microprocessor, FPGA Modules OSD32MP153A-512M-IAA product image

OSD32MP153A-512M-IAA

  • Description:SIP: 153A, 512MB, IAA
  • Series:-

SKU:7cef98ea9481 Category: Brand:

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OSD32MP153A-512M-IAA is listed in the Microcontrollers, Microprocessor, FPGA Modules range at ChipApex. The manufacturer field lists Octavo Systems LLC. Its product description is SIP: 153A, 512MB, IAA. Review the specifications below when checking this part for your BOM.

Microcontrollers, Microprocessor, FPGA Modules specifications for OSD32MP153A-512M-IAA

  • Description:SIP: 153A, 512MB, IAA
  • Series:-
  • Mfr:Octavo Systems LLC
  • Package:Tray
  • Module/Board Type:MPU Core
  • Core Processor:Arm® Dual Cortex®-A7, Arm® Cortex®-M4
  • Co-Processor:NEON™ SIMD
  • Speed:650MHz
  • Flash Size:-
  • RAM Size:512MB
  • Connector Type:302-BGA
  • Size / Dimension:0.710" L x 0.710" W (18.00mm x 18.00mm)
  • Operating Temperature:-40°C ~ 85°C

Microcontrollers, Microprocessor, FPGA Modules datasheet and documents for OSD32MP153A-512M-IAA

OSD32MP153A-512M-IAA

Microcontrollers, Microprocessor, FPGA Modules Overview

The OSD32MP153A-512M-IAA is a System-in-Package module from Octavo Systems, integrating an STM32MP1 microprocessor into a compact 18 mm × 18 mm BGA package. It features a dual-core Arm Cortex-A7 processor running up to 800 MHz and an Arm Cortex-M4 core operating at 209 MHz for real-time control. The module includes 512 Mbyte DDR3L memory, an STPMIC1 power management IC, EEPROM, MEMS oscillator, and over 100 passive components. This integration reduces the footprint by up to 64% compared to discrete designs, simplifying hardware complexity while providing rich connectivity options including USB 2.0, Ethernet, CAN FD, and various serial interfaces.

Microcontrollers, Microprocessor, FPGA Modules Feature Summary

  • Dual-core architecture with Arm Cortex-A7 (up to 800 MHz) and Cortex-M4 (up to 209 MHz)
  • Integrated 512 Mbyte DDR3L memory and STPMIC1 power management IC
  • Compact 18 mm × 18 mm 302-ball BGA package reducing footprint by up to 64%
  • Rich connectivity including USB 2.0 HS, Ethernet 10/100/1000, CAN FD, UART, SPI, I²C, SAI, QSPI, and camera interface

Microcontrollers, Microprocessor, FPGA Modules Applications

  • IoT applications requiring secure data handling
  • Human Machine Interface (HMI) systems
  • Real-time control systems

Microcontrollers, Microprocessor, FPGA Modules Part Context

This component belongs to the OSD32MP15x series of system-in-package modules. These modules are designed to deliver fully integrated STM32MP1 microprocessor systems in a small form factor, combining processing, memory, power management, and connectivity in a single BGA package to accelerate development for embedded applications.

OSD32MP153A-512M-IAAOSD32MP153A-512M-IAA

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