OSD32MP153C-512M-BAA

Microcontrollers, Microprocessor, FPGA Modules Overview

The OSD32MP153C-512M-BAA is a System-in-Package module from Octavo Systems, integrating an STM32MP1 microprocessor system within a compact 18 mm × 18 mm BGA package. It combines a dual-core Arm Cortex-A7 processor running up to 800 MHz with an Arm Cortex-M4 core operating at 209 MHz for real-time control. The module includes up to 512 Mbyte DDR3L memory, an STPMIC1 power management IC, EEPROM, MEMS oscillator, and over 100 passive components. This integration reduces the footprint by up to 64% compared to discrete designs, simplifying hardware complexity and accelerating development for IoT, HMI, and real-time control applications.

Microcontrollers, Microprocessor, FPGA Modules Feature Summary

• Dual-core architecture: Arm Cortex-A7 (up to 800 MHz) and Arm Cortex-M4 (up to 209 MHz)
• Integrated memory: Up to 512 Mbyte DDR3L
• Power management: STPMIC1 IC with single input voltage, integrated 5.2 V boost, buck converter, 4 LDOs, and 2 power switches
• Compact form factor: 18 mm × 18 mm 302-ball BGA package

Microcontrollers, Microprocessor, FPGA Modules Applications

• IoT devices requiring secure encryption
• Human Machine Interface (HMI) systems
• Real-time control applications

Microcontrollers, Microprocessor, FPGA Modules Part Context

This component belongs to the OSD32MP15x family of system-in-package modules. These modules are designed to deliver fully integrated STM32MP1 microprocessor systems in a small footprint, combining processing, memory, and power management into a single BGA package to simplify PCB design and reduce size.