OSD32MP157C-512M-BAA-ES

Microcontrollers, Microprocessor, FPGA Modules Overview

The OSD32MP157C-512M-BAA-ES is a System-in-Package module from Octavo Systems, integrating an STM32MP157C microprocessor. It features a dual-core Arm Cortex-A7 running up to 800 MHz and a Cortex-M4 coprocessor. The module includes 512 MB of DDR3L memory, an STPMIC1 power management IC, EEPROM, MEMS oscillator, and over 100 passives. Encased in a compact 18 mm x 18 mm BGA package, it operates within a voltage range of 4.5 V to 5.5 V and supports industrial temperatures from -40°C to +85°C.

Microcontrollers, Microprocessor, FPGA Modules Feature Summary

• Integrated STM32MP157C with dual Cortex-A7 (800 MHz) and Cortex-M4 (209 MHz) cores
• Onboard 512 MB DDR3L memory and STPMIC1 power management unit
• Compact 18 mm x 18 mm BGA footprint reducing PCB area by up to 64%
• Rich connectivity including USB 2.0, Ethernet, CAN FD, UART, SPI, I2C, and QSPI

Microcontrollers, Microprocessor, FPGA Modules Applications

• Industrial IoT gateways and edge computing nodes
• Human Machine Interface (HMI) displays
• Real-time control systems requiring secure boot and cryptography
• Embedded devices needing high performance in a small form factor

Microcontrollers, Microprocessor, FPGA Modules Procurement Notes

Verify the specific suffix 'BAA-ES' against the manufacturer's current datasheet to confirm exact memory configuration and commercial versus engineering sample status. Ensure compatibility with baseboard designs supporting the 18mm x 18mm BGA pitch. Check for RoHS compliance documentation and moisture sensitivity level ratings prior to assembly planning.

Microcontrollers, Microprocessor, FPGA Modules Selection Notes

Select this module when space constraints are critical, as its integrated design significantly reduces component count compared to discrete solutions. It is suitable for applications requiring both high-performance Linux processing on the A7 core and real-time deterministic tasks on the M4 core. Verify that the onboard 512 MB DDR3L meets the application's memory bandwidth and capacity requirements.

Microcontrollers, Microprocessor, FPGA Modules Part Context

This part belongs to the OSD32MP15x family of modules based on the STMicroelectronics STM32MP1 series. It shares the same physical footprint and pinout with other variants in the series, such as those with different memory sizes or processor grades, allowing for flexible supply chain management while maintaining hardware compatibility across product generations.

Microcontrollers, Microprocessor, FPGA Modules Replacement Considerations

Direct replacements within the Octavo portfolio include other OSD32MP15x variants with adjusted memory or temperature ranges. Cross-vendor alternatives require significant redesign due to the unique system-in-package integration of the processor, memory, and power management components.