OSD32MP157C-512M-BAA

Microcontrollers, Microprocessor, FPGA Modules Overview

The OSD32MP157C-512M-BAA is a System-in-Package (SiP) module from Octavo Systems, integrating an STM32MP1 microprocessor into a compact 18 mm × 18 mm BGA package. It features a dual-core Arm Cortex-A7 processor operating at up to 800 MHz and a Cortex-M4 real-time co-processor running at up to 209 MHz. The module includes 512 MB of DDR3L memory, an STPMIC1 power management IC, EEPROM, MEMS oscillator, and over 100 passive components. This integration reduces the footprint by up to 64% compared to discrete designs, providing high performance for IoT, HMI, and control applications.

Microcontrollers, Microprocessor, FPGA Modules Feature Summary

• Dual-core architecture with Arm Cortex-A7 (up to 800 MHz) and Cortex-M4 (up to 209 MHz)
• Integrated 512 MB DDR3L memory and STPMIC1 power management IC
• Compact 18 mm × 18 mm 302-ball BGA package reducing footprint by up to 64%
• Rich connectivity including USB 2.0 HS, Ethernet 10/100/1000, CAN FD, and camera interface

Microcontrollers, Microprocessor, FPGA Modules Applications

• Internet of Things (IoT) devices
• Human Machine Interface (HMI) systems
• Real-time control applications

Microcontrollers, Microprocessor, FPGA Modules Part Context

This component belongs to the OSD32MP15x series of system-in-package modules. These modules are designed to deliver a fully integrated STM32MP1 microprocessor system in a small form factor, simplifying hardware complexity and accelerating development cycles for embedded applications requiring both high-performance computing and real-time control capabilities.

Microcontrollers, Microprocessor, FPGA Modules Replacement Considerations

For pin-compatible or functionally similar alternatives within the same family, consider the OSD32MP15xA/D variants which offer different memory densities or industrial temperature ranges. Verify specific electrical characteristics and software compatibility when substituting.