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P89LPC921FDH,518 is listed in the Microcontrollers range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC MCU 8BIT 4KB FLASH 20TSSOP. Review the specifications below when checking this part for your BOM.
The P89LPC921FDH,518 is an 8-bit microcontroller featuring an accelerated two-clock 80C51 core. It integrates 4 kB of byte-erasable Flash code memory and 256 bytes of RAM. The device supports a 2.4 V to 3.6 V operating range with 5 V tolerant I/O pins. Key peripherals include two 16-bit counter/timers, an enhanced UART, a 400 kHz I2C bus port, two analog comparators, and a real-time clock/system timer. It operates within a temperature range of -40 °C to +85 °C at frequencies up to 18 MHz.
Verify the specific ordering suffix against current NXP documentation to confirm package type and environmental compliance status. Check official channels for availability as this component may be subject to end-of-life notices or obsolescence. Ensure the selected variant matches the required Flash memory size and package configuration for your design.
Select this model when a cost-effective solution with an accelerated 80C51 core is required. It is suitable for designs needing 4 kB of non-volatile storage and 256 bytes of RAM. Consider the 5 V tolerant I/O for interfacing with higher voltage logic levels without additional translators. Evaluate the integrated analog comparators if signal conditioning is needed.
This part belongs to the P89LPC92x series of 8-bit microcontrollers from NXP Semiconductors. The series is designed for high-integration applications, reducing component count and board space. It shares architectural similarities with other members like the P89LPC920 and P89LPC922, differing primarily in Flash memory capacity and specific peripheral configurations.
Direct substitutes within the same family include the P89LPC920FDH (2 kB Flash) and P89LPC922FDH (8 kB Flash). Verify pin compatibility and software compatibility when migrating between these variants due to identical TSSOP20 packaging and core architecture.
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