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The PAM8902ZER-P is a mono Class-D audio amplifier with an integrated boost converter, designed for piezo and ceramic speakers. It delivers a 30Vpp output from a 2.5V to 5.5V supply. The internal boost converter operates at 1.5MHz, generating up to 17.5V. Gain is selectable via the GSET pin at 18dB, 22dB, or 26dB. Boost voltage is configurable at 8V, 12V, or 17.5V using the VSET pin. Shutdown current is less than 1µA. It includes thermal, over-current, over-voltage, and short-circuit protection. The device is housed in a 16-ball CSP package measuring 1.95mm x 1.95mm.
Verify component authenticity through authorized Diodes Incorporated channels. Confirm datasheet revision DS36454 Rev. 2-3 matches specifications. Check manufacturing date codes on the marking for traceability. Ensure proper ESD handling during assembly due to the small CSP footprint. Validate that the application circuit supports the required input impedance and decoupling capacitor values.
Select this part when driving piezoelectric or ceramic speakers requiring high peak-to-peak voltage from low supply rails. Choose based on required gain setting by configuring the GSET pin. Select the appropriate boost voltage configuration via the VSET pin to optimize efficiency. Consider the 1.95mm x 1.95mm CSP package for space-constrained portable designs.
This component belongs to the PAM8902 product line of Diodes Incorporated. It is specifically engineered as a mono Class-D amplifier optimized for capacitive loads like piezo buzzers. The series integrates power management functions directly into the audio driver to minimize external component count.
The datasheet explicitly states: NOT RECOMMENDED FOR NEW DESIGN. Use PAM8902H instead. Verify if the PAM8902H offers identical pinout and electrical characteristics before substitution.
The VSET pin determines the boost output voltage. Connecting it to AVDD sets 17.5V, leaving it floating sets 12V, and connecting it to GND sets 8V.
The device enters a latch state. Normal operation requires cycling the ENA pin from logic low to logic high to clear the fault flag.
Thermal shutdown activates at +150°C. The device disables outputs and remains in shutdown until the die temperature drops by 30°C.