— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:CHIP ATTENUATOR, 3DB, 50O, 125MW
- Series:PAT
- Mfr:Susumu
- Package:Tape & Reel (TR),Cut Tape (CT)
- Attenuation Value:3dB
- Frequency Range:0 Hz ~ 3 GHz
- Power (Watts):125mW
- Impedance:50 Ohms
- Grade:-
- Qualification:-
- Package / Case:1206 (3216 Metric)
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Overview
The PAT1632-C-3DB-T1 is a high-precision chip attenuator manufactured by Susumu, designed for RF and microwave applications. It provides a nominal attenuation of 3 dB with a characteristic impedance of 50 ohms. The device operates from DC to 3 GHz and features a maximum Voltage Standing Wave Ratio (VSWR) of 1.3. It supports a power rating of 125 mW and is housed in a compact 1206 surface-mount package. The component functions reliably within an operating temperature range of -55°C to +125°C.
Feature Summary
- High precision attenuation performance suitable for demanding RF circuits
- Wide operational frequency range extending from DC to 3 GHz
- Robust thermal stability across extended industrial temperature ranges
Applications
- RF signal conditioning in wireless communication systems
- Test and measurement equipment requiring precise signal levels
- Mobile device front-end modules
- Base station infrastructure components
Procurement Notes
Verify the specific ordering suffix against official Susumu documentation to ensure correct packaging and tolerance specifications. Confirm that the 1206 footprint matches the target PCB layout constraints. Cross-reference the RoHS compliance status with current regulatory requirements for the intended market. Ensure storage conditions align with manufacturer guidelines to maintain component integrity prior to assembly.
Selection Notes
Select this component when a 3 dB attenuation value is required at 50 ohms impedance. Consider the 1206 package size for space-constrained designs. Evaluate the 125 mW power handling capability against peak signal levels. Verify that the 3 GHz upper frequency limit meets the system bandwidth requirements. Compare VSWR specifications with other available attenuators to ensure signal integrity standards are met.
Part Context
This part belongs to the Susumu PAT series of thin-film chip attenuators. These devices utilize silicon-based technology to deliver stable performance. The series includes various attenuation values and package sizes. The PAT1632-C-3DB-T1 specifically targets applications needing reliable DC-to-3 GHz operation. It complements other Susumu passive components in RF circuit design.
Replacement Considerations
Consult official Susumu substitution guides for direct equivalents. Verify compatibility regarding impedance, attenuation accuracy, and power ratings. Check package dimensions for mechanical fit. Ensure frequency response characteristics match the original design requirements before implementing any alternative components.
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