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The PC16550DVX is a single-channel Universal Asynchronous Receiver/Transmitter (UART) manufactured by National Semiconductor. It implements the functional features of the Intel 16C550A standard, providing independent transmit and receive data paths with 14-byte FIFO buffers for both directions to minimize CPU intervention during high-speed serial communication. The device supports baud rates up to 1.5 Mbps when operated at 3.3V. It integrates a full modem control interface, including support for RTS, CTS, DTR, DSR, RI, and DCD signals, enabling direct connection to RS-232 transceivers. The component operates within a supply voltage range of 3.0V to 3.6V and is housed in a 44-pin Thin Plastic Quad Flatpack (TQFP) package.
Verify the manufacturer origin carefully, as National Semiconductor's semiconductor assets were acquired by Texas Instruments. Confirm that the specific batch corresponds to National Semiconductor production rather than TI rebranding unless explicitly stated. Ensure the TQFP-44 package condition matches system requirements. Validate RoHS compliance status against current environmental regulations before finalizing procurement orders.
Select this component when a single UART channel with substantial FIFO depth is required for 3.3V logic systems. Compare against the NS16550AFV if a plastic LCC-44 package is preferred over TQFP. Consider alternative channels if multiple serial ports are needed simultaneously. Verify voltage tolerance levels match the target system's I/O standards to prevent signal integrity issues.
This part belongs to the 16C550 family of UARTs, which are industry-standard components for serial data transmission. It serves as a bridge between parallel microprocessor buses and asynchronous serial lines. The DVX suffix typically denotes the specific tape-and-reel packaging variant of the TQFP-44 package, distinguishing it from tray-packed equivalents.
The NS16550AFV is a pin-compatible alternative offering identical functionality in a different LCC-44 package format. Direct substitution requires verifying footprint compatibility between TQFP and LCC packages.