Memory IC PC28F00AP30BFB TR product image

PC28F00AP30BFB TR

  • Description:IC FLASH 1GBIT PAR 64EASYBGA
  • Series:Axcell™
  • Mfr:Micron Technology Inc.
  • Package:Tape & Reel (TR)

SKU:3fab3e50a87b Category: Brand:

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PC28F00AP30BFB TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC FLASH 1GBIT PAR 64EASYBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for PC28F00AP30BFB TR

  • Description:IC FLASH 1GBIT PAR 64EASYBGA
  • Series:Axcell™
  • Mfr:Micron Technology Inc.
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR
  • Memory Size:1Gbit
  • Memory Organization:64M x 16
  • Memory Interface:Parallel
  • Clock Frequency:52 MHz
  • Write Cycle Time - Word, Page:100ns
  • Voltage - Supply:1.7V ~ 2V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:64-TBGA
  • Supplier Device Package:64-EasyBGA (8x10)
  • Access Time:100 ns

Memory IC datasheet and documents for PC28F00AP30BFB TR

PC28F00AP30BFB TR

Memory IC Overview

The PC28F00AP30BFB TR is a Parallel NOR Flash memory component manufactured by Micron Technology Inc. It belongs to the Axcell P30 series, utilizing 65nm technology for embedded memory applications. The device features a 1 Gbit storage capacity organized as 64M x 16 bits with a parallel interface. It operates within a voltage range of 2.7V to 3.6V and supports asynchronous timing. The component is housed in a 64-pin EasyBGA package and is designed for surface mount installation.

Memory IC Feature Summary

  • Provides non-volatile data retention suitable for code execution directly from memory.
  • Supports flexible block organization with both symmetric and asymmetric erase capabilities.
  • Features high-speed asynchronous parallel access for legacy system integration.

Memory IC Applications

  • Embedded systems requiring direct code execution (XIP).
  • Industrial control equipment firmware storage.
  • Automotive electronics applications.

Memory IC Procurement Notes

Verify the specific suffix 'TR' against official Micron documentation to confirm tape-and-reel packaging status, as standard listings may indicate tray packaging. Ensure the part number matches the exact P30-65nm generation specifications. Confirm RoHS compliance and humidity sensitivity levels prior to procurement. Cross-reference the full part string with the manufacturer's current product status to avoid obsolete components.

Memory IC Selection Notes

Select this component for designs requiring 1 Gbit density with a parallel interface. It is suitable for applications needing 100 ns access times. Consider the 64-pin BGA footprint for board space constraints. Verify operating temperature ranges match the target environment. Compare against other P30 series variants if different block structures are required.

Memory IC Part Context

This part is part of Micron's Axcell P30 family of Parallel NOR Flash memories. These devices are engineered for embedded applications using 65nm process technology. The family offers various densities and package options to support diverse design requirements in industrial and automotive sectors.

Memory IC Replacement Considerations

Check for compatible parts within the PC28F00AP30 series, such as PC28F00AP30TFA or PC28F00AP33EFA, ensuring pin compatibility and electrical specifications align. Verify if alternative packages like LBGA are acceptable for the design.

PC28F00AP30BFB TRPC28F00AP30BFB TR

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