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PC713V0NSZX is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Sharp Microelectronics. Its product description is OPTOISO 5KV TRANS W/BASE 6-DIP. Review the specifications below when checking this part for your BOM.
The PC713V0NSZX is a single-channel transistor output optocoupler manufactured by Sharp Microelectronics. It features a phototransistor output with an accessible base terminal, housed in a 6-DIP package. The device provides 5000 Vrms isolation voltage and supports a maximum collector current of 50 mA. Key electrical parameters include a minimum current transfer ratio of 50% at 10 mA forward current, a maximum collector-emitter saturation voltage of 200 mV, and a typical rise/fall time of 10 µs/4 µs. It operates within a temperature range of -25°C to +100°C.
Verify RoHS compliance status as documentation indicates potential non-compliance. Confirm package type is 6-DIP and check for lead-free certification if required. Ensure the specific suffix matches the desired manufacturing variant. Validate datasheet version against current production standards before integration.
Select this component when a base-connected phototransistor is required for improved switching characteristics or external biasing. Compare CTR specifications against load requirements. Ensure the 5000 Vrms isolation rating meets system safety standards. Verify thermal dissipation capabilities within the operating temperature range.
This part belongs to Sharp's PC713 series of transistor output optocouplers. It shares functional similarities with other Sharp optoisolators but is distinguished by its 6-pin DIP configuration and base-accessible output structure. It serves as a standard solution for cost-effective galvanic isolation in legacy and modern electronic designs.
PC817X1NSZ1B offers similar isolation but lacks the base pin and uses a different package. PC81713NIP1B is an SMD alternative with comparable isolation but different current ratings. Direct pin-to-pin replacement requires verifying the base connection requirement and package footprint compatibility.
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