PCF8564AU/10AB/1,0

Real Time Clock Overview

The PCF8564AU/10AB/1,0 is a bare die CMOS real-time clock and calendar optimized for low power consumption. It provides year, month, day, weekday, hours, minutes, and seconds based on a 32.768 kHz quartz crystal. The device features a wide clock operating voltage of 1.0 V to 5.5 V and a low backup current typical of 250 nA at 3.0 V and 25 °C. It includes a programmable clock output (32.768 kHz, 1.024 kHz, 32 Hz, 1 Hz), alarm and timer functions, a low-voltage detector, and an internal Power-On Reset. Communication occurs via a 400 kHz two-wire I²C bus with slave addresses A2h (write) and A3h (read).

Real Time Clock Feature Summary

• CMOS RTC and calendar providing timekeeping based on a 32.768 kHz quartz crystal.
• Wide operating voltage range from 1.0 V to 5.5 V with typical backup current of 250 nA at 3.0 V.
• Programmable clock output offering frequencies of 32.768 kHz, 1.024 kHz, 32 Hz, and 1 Hz.
• Integrated low-voltage detector and internal Power-On Reset (POR) circuit.

Real Time Clock Applications

• Timing devices including time-of-day tracking and process timing.
• Portable instruments requiring low power operation.
• Electronic metering systems.
• Battery-powered products.

Real Time Clock Procurement Notes

Verify the specific ordering suffix against the datasheet Table 2. The suffix /10AB/1 indicates a wafer format, sawn on FFC. Confirm that the bare die package type matches the system integration requirements, as this is not a standard packaged component.

Real Time Clock Selection Notes

Select this part when a bare die RTC solution is required for space-constrained designs. Ensure the host system can handle the wire bond die interface. Verify that the 1.0 V to 5.5 V operating voltage range aligns with the target application's power supply constraints.

Real Time Clock Part Context

The PCF8564AU is the bare die version of the PCF8564A family. It shares functional specifications with packaged variants but differs in physical form factor. The AU designation specifically refers to the wire bond die configuration with 9 bonding pads.

Real Time Clock Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Consider evaluating other NXP RTC bare dies or packaged equivalents if the specific die format is incompatible with the manufacturing process.