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PCF8564AU/5BD/1,01 is listed in the Real Time Clock range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC RTC/CALENDAR UNCASED DIE. Review the specifications below when checking this part for your BOM.
The PCF8564AU/5BD/1,01 is a bare die CMOS real-time clock and calendar optimized for low power consumption. It provides year, month, day, weekday, hours, minutes, and seconds based on a 32.768 kHz quartz crystal. The device features a wide clock operating voltage of 1.0 V to 5.5 V and a low backup current typical of 250 nA at 3.0 V and 25 °C. It includes a 400 kHz two-wire I²C interface (1.8 V to 5.5 V), alarm and timer functions, a low-voltage detector, and programmable clock outputs.
Verify the specific ordering suffix /5BD/1,01 against official NXP documentation, as the provided datasheet lists similar suffixes such as /5BB/1,01 and /5GB/1,01 for unsawn wafers. Confirm that the component is supplied as an unsawn wafer or bare die wire bond package as indicated by the AU designation. Ensure compatibility with the intended packaging and handling requirements for bare silicon components.
Select this component when a bare die RTC solution is required for custom packaging or system-in-package integration. The PCF8564AU offers a wide voltage range suitable for various battery types. Consider the need for external assembly processes if choosing the bare die variant over packaged alternatives like the PCF8563. Verify that the application can accommodate the I²C bus speed limits and interrupt pin configurations.
The PCF8564A series is part of NXP's lineup of low-power real-time clocks. The AU suffix indicates a bare die wire bond die with 9 bonding pads. This form factor allows for direct integration into custom substrates or advanced packaging solutions where space constraints or specific electrical characteristics necessitate a die-level component rather than a standard surface-mount package.
The PCF8563 is a functionally similar packaged alternative offering alarm and timer functions. However, it requires a different physical footprint and mounting method. Direct pin-to-pin replacement is not possible due to the bare die nature of the PCF8564AU versus the SO8 or TSSOP packages of the PCF8563. System redesign is necessary for any substitution.
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