PCF8564AU/5GC/1,01

Real Time Clock Overview

The PCF8564AU/5GC/1,01 is a bare die CMOS real-time clock and calendar optimized for low power consumption. It provides year, month, day, weekday, hours, minutes, and seconds based on a 32.768 kHz quartz crystal. The device features a wide operating voltage range of 1.0 V to 5.5 V and a typical backup current of 250 nA at 3.0 V. It includes a programmable clock output (32.768 kHz, 1.024 kHz, 32 Hz, 1 Hz), alarm and timer functions, a low-voltage detector, and an internal Power-On Reset. Communication occurs via a 400 kHz two-wire I²C interface with slave addresses A2h (write) and A3h (read).

Real Time Clock Feature Summary

• Real-time clock and calendar tracking time and date with BCD-coded registers.
• Wide supply voltage range from 1.0 V to 5.5 V with low backup current.
• Programmable clock output frequencies: 32.768 kHz, 1.024 kHz, 32 Hz, and 1 Hz.
• Integrated alarm and countdown timer functions with interrupt capabilities.

Real Time Clock Applications

• Timing devices including time-of-day tracking and process timing.
• Portable instruments requiring low-power timekeeping.
• Electronic metering systems.
• Battery-powered products.

Real Time Clock Procurement Notes

Verify the ordering suffix /5GC/1,01 corresponds to the unsawn wafer delivery form as specified in the NXP data sheet. Confirm that the bare die package type matches the system's wire bonding or flip-chip requirements. Ensure the IC revision level meets the design specifications before integration.

Real Time Clock Selection Notes

Select this component when a bare die RTC solution is required for space-constrained designs. The PCF8564AU variant supports wire bonding, while the AUG variant uses bumps. Verify that the application can accommodate the external 32.768 kHz crystal and integrated oscillator capacitors. Check compatibility with the host microcontroller's I²C bus voltage levels.

Real Time Clock Part Context

The PCF8564AU/5GC/1,01 belongs to the PCF8564A family of real-time clocks manufactured by NXP Semiconductors. This specific part number denotes the AU bare die version supplied on an unsawn wafer. Other variants include the UG bump die and packaged versions like the SO16 package.

Real Time Clock Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Designers should consult NXP for alternative components if the specific bare die configuration is unavailable.