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PCK3807APW,118 is listed in the Clock Buffers, Drivers range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC CLK BUF 1:10 400MHZ 20TSSOP. Review the specifications below when checking this part for your BOM.
The PCK3807APW,118 is a 1:10 LVTTL clock distribution device manufactured by NXP USA Inc. (formerly Philips Semiconductors). It provides low skew clock driver functionality with one input and ten outputs. The component operates from a single 2.5 V or 3.3 V supply voltage within the industrial temperature range of –40 °C to +85 °C. It supports operation up to 150 MHz with a maximum output frequency capability of 400 MHz. Key electrical parameters include an input capacitance of 2.5 pF typical, output rise/fall times of 1.0 ns, and package skew of 0.6 ns.
Verify the ordering code PCK3807APW against the specific package requirement. The suffix PW indicates a 20-lead Plastic TSSOP package (SOT360-1). Confirm that the industrial temperature grade (-40 °C to +85 °C) matches the system requirements. Ensure the design accounts for the recommended operating conditions, specifically the DC supply voltage limits of 2.3 V to 3.6 V.
Select this component when a 1:10 LVTTL fan-out is required with low skew characteristics. The TSSOP-20 package is suitable for surface-mount applications. Consider the dynamic power supply current, which varies with frequency and load capacitance. For loads exceeding 50 pF, verify that the propagation delay and frequency limits remain within acceptable bounds for the application timing constraints.
This part belongs to the PCK3807A family of 1:10 LVTTL clock distribution devices. Other variants in the series include PCK3807AD (SO), PCK3807ADB (SSOP), and PCK3807ADS (QSOP), all sharing the same functional specifications but differing in package type. The APW designation specifically identifies the TSSOP package variant.
Direct pin-compatible replacements within the same family include PCK3807AD, PCK3807ADB, and PCK3807ADS. Verify package dimensions and lead pitch compatibility before substitution. Cross-family replacements require verification of logic levels, voltage tolerances, and skew specifications.
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