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PE4820-I-2302401 is listed in the Power Transformers range at ChipApex. The manufacturer field lists PowerUC Electronics. Its product description is 12VA 230V 24V. Review the specifications below when checking this part for your BOM.
The PE4820-I-2302401 is a PCB safety isolation transformer manufactured by PowerUC Electronics. It features a laminated core design with vacuum epoxy encapsulation for high proof voltage and durability. The unit provides electrical isolation suitable for power distribution applications. Primary voltage specifications include 110V, 220V, or 230V inputs. Secondary output is configured at 24V. The device is designed for direct printed circuit board mounting.
Verify the specific secondary current rating against project requirements, as datasheets may list variants such as 625mA for similar models. Confirm that the 230V primary input aligns with local mains standards. Ensure PCB layout accommodates the physical footprint of the vacuum-molded package to maintain mechanical stability during operation.
Select this component when strict safety isolation is required in compact designs. The vacuum molding process offers superior insulation compared to standard potting. Consider the thermal dissipation characteristics of the laminated core if operating near maximum load limits. Verify compatibility with the target PCB soldering profile to prevent damage to the encapsulated structure.
This model belongs to the PE series of PCB safety isolation transformers from PowerUC Electronics. These components are engineered for accurate voltage measurement support and signal conversion functions. The series emphasizes robust construction through vacuum molding techniques to withstand high voltage stresses in industrial and commercial electronic assemblies.
Direct substitutes must match the 24V secondary output and 230V primary input configuration. Verify that alternative transformers provide equivalent isolation ratings and physical dimensions for PCB compatibility. Cross-reference manufacturer datasheets to ensure identical encapsulation methods and core materials for performance parity.
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