PE7025-3

Overview

The Pasternack PE7025-3 is a fixed coaxial attenuator designed for RF signal management. It provides a nominal attenuation of 3 dB with an accuracy of ±1 dB across a frequency range from DC to 2 GHz. The component features BNC male-to-BNC female connectors and maintains a 50 Ohm impedance. It is rated for a maximum input power of 10 Watts CW. The unit utilizes a black anodized aluminum heatsink body, ensuring thermal stability and durability in high-power applications.

Feature Summary

• Bidirectional signal attenuation capability
• Black anodized aluminum heatsink body construction
• BNC male to BNC female connector interface

Applications

• RF instrumentation systems
• Precision measurement setups
• Signal level control in test environments

Procurement Notes

Verify the specific datasheet version for the PE7025-3 model to confirm current manufacturing status and detailed mechanical dimensions. Ensure compatibility with existing BNC connector interfaces and validate that the 10 Watt power rating meets system requirements. Cross-reference official Pasternack documentation for any updates regarding material specifications or performance tolerances prior to integration.

Selection Notes

Select this component when a precise 3 dB reduction is required within the 2 GHz bandwidth. The 50 Ohm impedance matches standard RF infrastructure. Consider the heatsink design for thermal management needs. Verify connector gender and orientation fit the physical layout constraints of the assembly before procurement.

Part Context

This part belongs to the Pasternack PE7025 series of fixed attenuators. These components are engineered for reliable performance in demanding RF environments. The series offers various attenuation values while maintaining consistent electrical characteristics and robust mechanical construction using aluminum heatsink bodies.

Replacement Considerations

Check for exact matching attenuation values and frequency ranges when substituting. Ensure connector types and impedances align with the existing circuit design. Verify power handling capabilities to prevent thermal failure in the new configuration.