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PEF 22628 E V1.2-G is listed in the Telecom range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IC TELECOM INTERFACE 324-LBGA. Review the specifications below when checking this part for your BOM.
The Infineon PEF 22628 E V1.2-G is a symmetric DSL transceiver IC belonging to the SOCRATES family, designed for Ethernet First Mile (EFM) applications. It integrates two SHDSL channels within a 324-LBGA surface-mount package. The device operates on dual power supplies of 1.5V and 3.3V, with a typical power consumption of 650 mW. It supports HDLC and serial interfaces for data transmission. The component functions reliably across an extended industrial temperature range from -40°C to +85°C.
This specific part number is officially listed as obsolete or discontinued by the manufacturer. Availability is restricted, and sourcing may require checking secondary distributors or existing stock. Verify end-of-life status and lead times carefully before design finalization to ensure supply chain continuity for production runs.
Engineers should evaluate this component primarily for legacy system maintenance or retrofitting projects where SHDSL compatibility is mandatory. Due to its discontinued status, new designs should consider modern alternatives offering similar channel counts and EFM support with longer availability lifecycles. Ensure the 324-LBGA footprint matches the target PCB layout constraints.
The PEF 22628 E V1.2-G is part of Infineon's SOCRATES series, which focuses on providing integrated solutions for telecommunications interfaces. This specific model targets the SHDSL market segment, bridging copper lines with Ethernet networks. It represents a specialized solution for service providers deploying symmetric bandwidth services over existing telephone infrastructure.
As the PEF 22628 E V1.2-G is discontinued, no direct public substitute part numbers are confirmed in the provided documentation. Designers must identify alternative SHDSL transceivers that match the 2-channel requirement, LBGA packaging, and EFM specifications through independent technical comparison.
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