PEMI6QFN/LM,132

Overview

The PEMI6QFN/LM,132 is a Surface Mount Device (SMD) EMI/RFI filter manufactured by NXP USA Inc. It functions as a second-order low-pass RC Pi network filter designed for signal integrity applications. The component features six independent channels within a compact package. Key electrical parameters include a resistance value of 65 Ohms per channel and a total capacitance of 16 picofarads distributed across the network. This configuration provides effective attenuation of high-frequency noise while maintaining signal fidelity in sensitive electronic circuits.

Feature Summary

• Integrates a six-channel RC Pi network topology for multi-line filtering
• Provides second-order low-pass filtering characteristics to suppress electromagnetic interference
• Utilizes a compact surface-mount design suitable for space-constrained PCB layouts

Applications

• High-speed digital interface noise suppression
• Signal conditioning for data transmission lines
• Electromagnetic compatibility enhancement in consumer electronics

Procurement Notes

Verify the specific suffix 'LM' against official Nexperia/NXP documentation to confirm the exact resistance and capacitance values, as suffix variations often denote different component tolerances or parameter sets. Ensure the ordering code matches the required package variant and that the source provides valid RoHS compliance documentation consistent with current manufacturing standards.

Selection Notes

Select this component when a multi-channel solution is required for simultaneous noise reduction on parallel data lines. The 65-ohm resistance and 16-picofarad total capacitance define the cutoff frequency and impedance matching characteristics. Evaluate the thermal performance and physical footprint constraints of the XFDFN package relative to the available board space and soldering capabilities.

Part Context

This part belongs to the PEMIxQFN family of EMI filters from NXP Semiconductors. These components are engineered to replace discrete resistor and capacitor networks, thereby reducing assembly complexity and improving reliability. The QFN-style packaging offers superior thermal dissipation and electrical performance compared to traditional leaded packages, aligning with modern miniaturization trends in semiconductor design.

Replacement Considerations

Consult the official PEMIxQFN datasheet for confirmed substitute part numbers. Variations such as PEMI6QFN/LK,132 or PEMI6QFN/LT,132 may exist within the same family but could possess different electrical specifications. Do not assume interchangeability without verifying pinout compatibility and parameter alignment through manufacturer cross-reference tools.