PEMI8QFN/LE,132

Overview

The PEMI8QFN/LE,132 is an integrated EMI filter manufactured by NXP USA Inc., designed for surface-mount applications. It features an eight-channel configuration within a 16-XFDFN package with an exposed pad. The component operates as a second-order low-pass RC (Pi) filter, providing signal integrity protection against electromagnetic interference. Key electrical characteristics include a channel resistance of 65 ohms and a total capacitance of 8.5 picofarads. It offers electrostatic discharge protection and achieves an attenuation value of 11 decibels at frequencies ranging from 800 megahertz to 3 gigahertz.

Feature Summary

• Integrates eight independent filtering channels in a compact footprint
• Provides effective high-frequency noise suppression via RC topology
• Includes built-in electrostatic discharge protection mechanisms

Applications

• High-speed data line protection in consumer electronics
• Signal conditioning for USB and HDMI interfaces
• EMI mitigation in mobile communication devices

Procurement Notes

Verify the specific suffix LE,132 to ensure correct packaging and tape-and-reel specifications. Confirm that the 16-pin XFDFN footprint matches the target PCB layout. Check current manufacturing status as components may be subject to end-of-life notices or tariff regulations depending on the shipping destination. Ensure compatibility with standard reflow soldering profiles for QFN packages.

Selection Notes

Select this component when multi-channel EMI filtering is required for high-speed digital signals. The 65-ohm resistance and low capacitance make it suitable for preserving signal integrity while attenuating noise above 800 MHz. Consider the 16-pin exposed pad package for thermal management and space-constrained designs. Evaluate the need for integrated ESD protection alongside filtering capabilities.

Part Context

This part belongs to the family of integrated passive device filters offered by NXP Semiconductors. It combines resistive and capacitive elements into a single monolithic structure to replace discrete components. The design aims to reduce board space and improve reliability by minimizing interconnect parasitics associated with separate R and C components.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation.