PFS7329H

Overview

The PFS7329H is a high-power Power Factor Correction (PFC) controller from the HiperPFS-2 family, integrating a 600V MOSFET and Qspeed diode. It supports continuous conduction mode (CCM) with up to 425W peak output power. The device operates on a 13-pin eSIP-16D package for through-hole mounting. Input voltage ranges from 90V AC to 265V AC, with a maximum DC output of 385V. It features an 8.8A current limit and delivers a maximum output current of 15.8A. Operating temperatures span -40°C to +125°C or +150°C depending on specific thermal conditions.

Feature Summary

• Eliminates external current sense resistors to reduce power loss
• Integrates high-voltage MOSFET and Qspeed diode for compact design
• Optimized for high power factor and efficiency across load range

Applications

• PC power supplies
• High-power LED lighting
• LCD TV power adapters
• Video game consoles
• Industrial appliances

Procurement Notes

Verify the exact suffix and package variant against the manufacturer's latest datasheet, as pin counts and thermal ratings may vary between eSIP configurations. Confirm operating temperature limits and mounting requirements before integration. Ensure compatibility with system input voltage ranges and thermal management solutions.

Selection Notes

Select this component for applications requiring high-efficiency PFC in a compact form factor. The integrated MOSFET reduces bill of materials count. Consider thermal performance and heat sink mounting options due to the exposed pad design. Verify that the 600V rating meets the system's voltage stress requirements.

Part Context

Part of the HiperPFS-2 family designed for high-power PFC applications. Combines control logic with power switching elements to simplify converter design. Targets compliance with energy efficiency standards while maintaining high power density in consumer and industrial electronics.

Replacement Considerations

Check for direct substitutes within the HiperPFS series with similar pinouts and electrical ratings. Verify thermal characteristics and package dimensions when considering alternative models from other manufacturers.