PFS7729H

Overview

The PFS7729H is a Power Factor Correction (PFC) controller from the HiperPFS-4 family, designed for continuous conduction mode (CCM) applications. It integrates a 600 V MOSFET and diode option within a single low-profile eSIP-16D package. The device operates at a switching frequency of 60 kHz with a supply voltage range of 10.2 V to 15 V. It supports universal input devices with a peak output power of 450 W in full power mode. The component maintains an efficiency greater than 95% across loads from 10% to 100%, with no-load consumption below 60 mW. Operating temperatures range from -40 °C to +150 °C.

Feature Summary

• Integrates a 600 V MOSFET and diode option in a single low-profile power package
• Optimized for high efficiency and high power factor across the entire load range
• Enables the smallest possible boost PFC converter footprint due to high integration

Applications

• Universal input power supplies
• High-efficiency AC/DC converters
• Power factor correction stages in consumer electronics

Procurement Notes

Verify the specific suffix against official datasheets to confirm pinout and thermal characteristics. Ensure the selected variant matches the required mounting style, as surface mount and through-hole options may exist within the series. Confirm RoHS compliance status directly with the manufacturer or authorized distributors prior to finalizing procurement orders.

Selection Notes

Select this component for designs requiring high power density and minimal external component count. The integrated MOSFET reduces board space and simplifies thermal management compared to discrete solutions. Consider the 600 V rating when designing for universal line voltages. Evaluate the 60 kHz switching frequency against EMI requirements and transformer size constraints.

Part Context

The PFS7729H belongs to the HiperPFS-4 family, which focuses on high-performance power factor correction. This series is engineered to meet stringent energy efficiency standards while minimizing physical size. The eSIP packaging technology allows for efficient heat dissipation without requiring additional insulating pads, facilitating compact and reliable power supply designs.

Replacement Considerations

Consult official substitution lists for compatible parts within the HiperPFS family. Verify pin compatibility and electrical ratings before replacing existing components.