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PGA302EPWT is listed in the Sensor And Detector Interfaces range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is SENSOR SIGNAL CONDITIONER WITH 0. Review the specifications below when checking this part for your BOM.
The PGA302EPWT is a sensor signal conditioner manufactured by Texas Instruments, designed for precision analog front-end applications. It operates within a supply voltage range of 4.5 V to 5.5 V, with a typical operating current of 6.5 mA. The device features an internal 2.5 V reference and supports I2C interface communication. It is housed in a 16-TSSOP package suitable for surface mount installation. The component functions across an extended temperature range from -40°C to +150°C, ensuring reliability in demanding environments.
Verify the specific suffix EPWT against the official Texas Instruments datasheet to confirm the TSSOP-16 package and reel packaging configuration. Ensure compatibility with the PGA302EVM-037 evaluation module if development support is required. Confirm moisture sensitivity level 3 handling procedures are followed during assembly to prevent damage.
Select this component when a single-channel signal conditioner with I2C digital output is required. Compare against the PGA302EPWR variant if dual-channel functionality or different packaging quantities are needed. Verify that the 16-TSSOP footprint fits the target PCB layout constraints and that the 5 V supply rail aligns with the system power architecture.
This part belongs to the PGA302 series of sensor interface ICs from Texas Instruments. It is specifically engineered for applications requiring precise signal conditioning and digital calibration. The EPWT designation indicates the tape-and-reel packaging format, distinguishing it from other package or quantity variations within the same functional family.
The PGA302EPWR is a verified alternative within the same series, offering identical core functionality but potentially differing in channel count or standard packaging quantities. Verify pin-to-pin compatibility and software register mapping before substitution to ensure seamless integration into existing designs.
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