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PI3DBS16222XEAEX is listed in the Analog Switches - Special Purpose range at ChipApex. The manufacturer field lists Diodes Incorporated. Its product description is PCIE SWITCH X1-QFN2040-24. Review the specifications below when checking this part for your BOM.
The PI3DBS16222XEAEX is a differential exchange switch from Diodes Incorporated, operating at data rates up to 20Gbps. It features four differential channels configured as a 2x2 exchange switch with a pass-through pinout. The device supports bidirectional operation and functions within a VDD operating range of 3.3V ± 10%. It maintains an industrial temperature range from -40°C to +85°C. Key electrical parameters include low bit-to-bit skew of 10ps, crosstalk of -30dB at 4.0GHz and -19dB at 8.0GHz, and insertion loss of -1.0dB at 4.0GHz, -1.5dB at 8.0GHz, and -2.0dB at 10GHz.
Verify the specific package variant when ordering, as the XEA suffix denotes the 24-contact X1QFN package. Confirm compliance requirements such as RoHS and halogen-free status against project specifications. Ensure the selected component matches the required industrial temperature range and voltage specifications for the target application environment before finalizing procurement.
Select this component for designs requiring a 2x2 differential exchange switch capable of handling 20Gbps signals. Consider the X1QFN package dimensions if board space is constrained. Evaluate the low insertion loss and crosstalk characteristics against system signal integrity budgets. Verify that the 3.3V supply voltage aligns with the platform's power distribution network.
This part belongs to the PI3DBS16213 series of multiplexer/demultiplexer switches manufactured by Diodes Incorporated. The series includes various configurations for high-speed serial interface routing. The PI3DBS16222 specifically addresses the need for bidirectional exchange switching in next-generation peripheral interconnects.
The PI3DBS16222ZLEX serves as a package alternative using the 30-contact TQFN format. Verify pin compatibility and thermal performance when substituting between the X1QFN and TQFN packages. No other functional replacements are documented in the provided source material.
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