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PI3EQX8908A2ZFEX is listed in the Signal Buffers, Repeaters, Splitters range at ChipApex. The manufacturer field lists Diodes Incorporated. Its product description is PCIE EQX W-QFN55100-54 T&R 3.5K. Review the specifications below when checking this part for your BOM.
The PI3EQX8908A2ZFEX is an 8-channel PCI Express ReDriver designed for 2.5Gbps, 5.0Gbps, and 8.0Gbps serial links. It supports PCIe Gen 1/2/3 protocols and provides programmable linear equalization, output swing, and flat gain to reduce inter-symbol interference. The device features eight 100-Ohm differential CML data I/Os and operates on a single 3.3V±0.3V supply voltage within an industrial temperature range of -40°C to +85°C. Configuration is achieved via pin strapping, I2C control, or external EEPROM loading. It utilizes a 54-contact Very Thin Quad Flat No-Lead (TQFN) package.
Verify the specific ordering suffix ZFEX confirms the 54-contact TQFN package in Tape & Reel format. Ensure the design accommodates the 3.3V power supply requirement and the specified industrial temperature operating range. Confirm that the I2C address bits are correctly configured if software control is utilized instead of pin strapping or EEPROM methods.
Select this component when designing systems requiring support for PCIe Gen 1 through Gen 3 speeds up to 8.0Gbps. It is suitable for applications needing linear equalization to mitigate channel loss without introducing non-linear distortion. Consider the 54-contact TQFN package constraints and the availability of I2C or EEPROM interfaces for configuration management during the hardware design phase.
This part belongs to the PI3EQX8908A product line from Diodes Incorporated, specifically engineered as a PCIe ReDriver. It extends the capabilities of the base PI3EQX8908A2 by providing the Tape & Reel packaging option (indicated by the X suffix), facilitating automated surface-mount assembly processes while maintaining identical electrical and functional specifications.
The PI3EQX8908A2ZFE serves as the tray-packaged equivalent. Verify compatibility with existing PCB footprints and configuration methods when substituting between reel and tray variants.
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