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PI49FCT32807SE is listed in the Clock Buffers, Drivers range at ChipApex. The manufacturer field lists Diodes Incorporated. Its product description is IC CLK BUFFER 1:10 133MHZ 20SOIC. Review the specifications below when checking this part for your BOM.
The PI49FCT32807SE is a 3.3V CMOS clock driver manufactured by Diodes Incorporated, featuring a single input and ten outputs. It operates within a supply voltage range of 3.0V to 3.6V and supports frequencies up to 133 MHz. The device integrates internal series damping resistors with a typical value of 22 ohms on all outputs. Key electrical parameters include a maximum propagation delay of 2.5 ns, output skew of 0.20 ns, and quiescent current of 30 µA. It is housed in a 20-pin SOIC package and functions across an industrial temperature range of -40°C to +85°C.
Verify the specific ordering suffix 'S' corresponds to the 20-pin 300-mil wide SOIC package as defined in the datasheet. Confirm that the component meets Pb-free and Green manufacturing standards. Check for any product discontinuation notifications or PCN updates from the manufacturer regarding this specific part number before finalizing procurement plans.
Select this component when a 1:10 fan-out ratio is required for 3.3V CMOS clock signals. Ensure the application frequency does not exceed 133 MHz and the load capacitance remains within the tested limits (e.g., 15pF). Verify that the 22-ohm integrated series resistance aligns with the target impedance requirements of the downstream circuitry.
This component belongs to the PI49FCT32807 family of 3.3V clock drivers. The 'SE' designation specifically identifies the 20-pin Small Outline Integrated Circuit (SOIC) package variant. Other variants in the family include the QSOP (Q) and SSOP (H) packages, which share identical electrical characteristics but differ in physical dimensions.
Direct pin-compatible replacements within the same package type include the PI49FCT32807QE (QSOP) and PI49FCT32807HE (SSOP), provided the board layout accommodates the respective package footprints. Cross-package substitution requires verifying mechanical fit and thermal performance.
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