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PIC32CM2532LE00100T-I/PF is listed in the Microcontrollers range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC MCU 32BIT 512KB FLASH 100TQFP. Review the specifications below when checking this part for your BOM.
The PIC32CM2532LE00100T-I/PF is an ARM Cortex-M23 microcontroller featuring 256 kB of Flash memory and 32 kB of SRAM. It operates at a maximum clock frequency of 48 MHz within a voltage range of 1.62 V to 3.63 V. The device includes a 12-bit ADC with 24 channels, two 12-bit DACs, and multiple communication interfaces including SPI, I2C, I2S, USART, and USB Device. It is housed in a 100-pin QFP package.
Verify the specific suffix 'I/PF' corresponds to the industrial temperature range (-40°C to +85°C) and the 100-pin QFP package configuration. Confirm that the 'T' designation indicates tape and reel packaging if required for automated assembly. Cross-reference the full part number against the official Microchip datasheet to ensure compatibility with your system's voltage and pinout requirements before procurement.
Select this component when a balance of ultra-low power efficiency and moderate processing capability is required. The inclusion of dedicated touch sensing hardware makes it suitable for user interface applications without additional external controllers. Ensure the design accommodates the 1.62 V to 3.63 V supply range and utilizes the available GPIOs for the necessary peripheral connections.
This part belongs to the PIC32CM LE00 family, which integrates Arm Cortex-M23 cores with enhanced analog capabilities. The series emphasizes energy efficiency for always-on applications while providing sufficient computational power for complex tasks. The LE00 family distinguishes itself through integrated touch sensing and smart analog features, reducing bill-of-materials complexity.
Check for updated revisions within the PIC32CM2532LE00100 series. Verify pin-to-pin compatibility with previous generations if migrating from older PIC32CM designs. Consult Microchip documentation for any functional differences between package variants or temperature grades.
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