Microcontrollers PIC32CZ2051CA70100-I/XEB product image

PIC32CZ2051CA70100-I/XEB

  • Description:CM7, 2048KB FLASH, 512KB SRAM, E
  • Series:PIC® 32CZ
  • Mfr:Microchip Technology
  • Package:Tray
  • Core Processor:ARM® Cortex®-M7F

SKU:a11d914aaaf1 Category: Brand:

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PIC32CZ2051CA70100-I/XEB is listed in the Microcontrollers range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is CM7, 2048KB FLASH, 512KB SRAM, E. Review the specifications below when checking this part for your BOM.

Microcontrollers specifications for PIC32CZ2051CA70100-I/XEB

  • Description:CM7, 2048KB FLASH, 512KB SRAM, E
  • Series:PIC® 32CZ
  • Mfr:Microchip Technology
  • Package:Tray
  • Core Processor:ARM® Cortex®-M7F
  • Core Size:32-Bit
  • Speed:300MHz
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
  • Peripherals:Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
  • Number of I/O:75
  • Program Memory Size:2MB (2M x 8)
  • Program Memory Type:FLASH
  • EEPROM Size:-
  • RAM Size:512K x 8
  • Voltage - Supply (Vcc/Vdd):2.5V ~ 3.6V
  • Data Converters:A/D 10x12b SAR
  • Oscillator Type:External, Internal
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Supplier Device Package:100-TQFP (14x14)
  • Package / Case:100-TQFP Exposed Pad
  • Grade:-
  • Qualification:-

Microcontrollers datasheet and documents for PIC32CZ2051CA70100-I/XEB

PIC32CZ2051CA70100-I/XEB

Microcontrollers Overview

The PIC32CZ2051CA70100-I/XEB is an ARM Cortex-M7 microcontroller from the PIC32CZ CA70 family, manufactured by Microchip Technology. It features a 300 MHz maximum clock frequency, 2 MB of Flash program memory, and 512 KB of SRAM. The device is housed in a TFBGA-100 package and provides up to 75 I/O lines with external interrupt capabilities. It integrates multiple communication interfaces including Ethernet MAC (GMAC), dual CAN controllers, and various serial peripherals for embedded system applications.

Microcontrollers Feature Summary

  • High-performance ARM Cortex-M7 core operating at up to 300 MHz
  • Integrated GMAC and dual CAN controllers for robust connectivity
  • Large memory configuration with 2 MB Flash and 512 KB SRAM
  • Flexible I/O expansion supporting external interrupts

Microcontrollers Applications

  • Robotics control systems
  • Bluetooth audio processing
  • Internet of Things (IoT) devices
  • Industrial automation concepts

Microcontrollers Procurement Notes

Verify the specific suffix -I/XEB against official Microchip documentation to confirm temperature range and packaging details. Ensure compatibility with existing PCB footprints for the TFBGA-100 package. Cross-reference pin assignments with the datasheet to validate interface connections before finalizing procurement orders.

Microcontrollers Selection Notes

Select this component when high computational throughput is required alongside significant on-chip memory. The integration of GMAC and dual CAN makes it suitable for networked industrial applications. Consider the TFBGA-100 package constraints during layout design. Evaluate power consumption profiles against system requirements for battery-operated or thermally constrained environments.

Microcontrollers Part Context

This MCU belongs to the PIC32CZ CA70 series, designed for performance-critical embedded applications. It shares architectural similarities with other CA70 variants but offers specific memory and package configurations. The series emphasizes low latency and high efficiency for real-time control tasks in modern electronic designs.

Microcontrollers Replacement Considerations

Consult Microchip's official cross-reference tools for verified substitutes within the PIC32CZ family. Ensure any replacement maintains compatible pinouts and memory sizes. Verify that alternative packages do not require redesigning the host board infrastructure.

PIC32CZ2051CA70100-I/XEBPIC32CZ2051CA70100-I/XEB

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