PIMZ2,125

Overview

The PIMZ2 is an NPN/PNP general-purpose double transistor manufactured by Nexperia. It integrates two transistors into a single SOT457 (SC-74) surface-mounted package. The device features a collector-emitter voltage of 50 V and a DC collector current of 150 mA per transistor. Total power dissipation is rated at 300 mW at 25 °C ambient temperature. Thermal resistance from junction to ambient is 417 K/W for the complete device. The component supports operation within an ambient temperature range of -65 °C to +150 °C.

Feature Summary

• Simplified circuit design through integrated dual-transistor configuration
• Reduced component count in electronic assemblies
• Lowered pick and place manufacturing costs

Applications

• General-purpose switching circuits
• Amplification applications

Procurement Notes

Verify the specific ordering suffix against the manufacturer's latest documentation to confirm origin and reel specifications. Confirm RoHS compliance status directly with the supplier or official datasheet revisions before finalizing procurement orders. Ensure the package type matches the required PCB footprint.

Selection Notes

Select this component when space constraints require integrating both NPN and PNP functions into one small outline transistor package. Verify that the 150 mA continuous current rating and 50 V breakdown voltage meet the specific circuit requirements. Check thermal management needs against the 417 K/W junction-to-ambient resistance value.

Part Context

This part belongs to the Nexperia family of NPN/PNP general-purpose double transistors. It shares functional similarities with other dual-transistor packages but is distinct due to its specific SOT457 form factor and electrical ratings. It serves as a compact alternative to discrete transistor pairs in signal processing and control logic.

Replacement Considerations

PUMZ2 is listed as a variant in the same product family, utilizing the SOT363 package instead of SOT457. Cross-package substitution requires verifying pinout compatibility and physical footprint differences on the target printed-circuit board.