PIP3107-D,118

PIP3107-D,118

  • Description:IC PWR DRIVER N-CHANNEL 1:1 DPAK
  • Series:TOPFET™
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)

SKU:7b6e871464b3 Category: Brand:

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Product Detailed Parameters

  • Description:IC PWR DRIVER N-CHANNEL 1:1 DPAK
  • Series:TOPFET™
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)
  • Switch Type:General Purpose
  • Number of Outputs:1
  • Ratio - Input:Output:1:01
  • Output Configuration:Low Side
  • Output Type:N-Channel
  • Interface:On/Off
  • Voltage - Load:50V (Max)
  • Voltage - Supply (Vcc/Vdd):Not Required
  • Current - Output (Max):16A
  • Rds On (Typ):36mOhm
  • Input Type:Non-Inverting
  • Features:-
  • Fault Protection:Current Limiting (Fixed), Over Temperature, Over Voltage
  • Operating Temperature:-
  • Mounting Type:Surface Mount
  • Supplier Device Package:DPAK
  • Package / Case:TO-252-3, DPAK (2 Leads + Tab), SC-63
  • Grade:-
  • Qualification:-

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PIP3107-D,118

Overview

The PIP3107-D,118 is a monolithic power MOSFET utilizing TOPFET2 technology, designed for logic-level switching applications. It features an N-channel configuration with a maximum voltage rating of 50V and a continuous current capacity of 16A. The device is housed in a DPAK surface-mount package. Integrated protection mechanisms include thermal shutdown and overload protection, ensuring reliability in general-purpose power distribution tasks.

Feature Summary

  • Monolithic integration of logic-level power MOSFET with TOPFET2 technology
  • Built-in thermal and overload protection mechanisms
  • N-channel configuration optimized for low-side switching

Applications

  • General-purpose power distribution switches
  • Low-side load driver circuits
  • Logic-level controlled power management systems

Procurement Notes

Verify the specific ordering suffix

Selection Notes

Select this component for applications requiring robust integrated protection in a compact surface-mount form factor. Ensure the control logic operates at compatible voltage levels to fully enhance the N-channel device. Consider the thermal performance within the DPAK package when designing heat dissipation strategies for high-current loads.

Part Context

This part belongs to the PIP series of power drivers from NXP Semiconductors. These components are engineered as smart power switches, combining the functionality of a MOSFET with essential protection features in a single silicon die. The series targets industrial and consumer electronics where space efficiency and circuit reliability are critical priorities.

Replacement Considerations

Cross-reference with other NXP TOPFET2 devices or equivalent N-channel power switches from manufacturers like STMicroelectronics or Infineon. Verify that substitute parts match the 50V rating, 16A current capacity, and DPAK package dimensions to ensure mechanical and electrical compatibility.

PIP3107-D,118PIP3107-D,118

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