PM41036B1-F3EI

PM41036B1-F3EI

  • Description:PCIE SWITCH GEN4 X36 PSX 753BBGA
  • Series:Switchtec

SKU:d1fad5c4d8ec Category: Brand:

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Product Detailed Parameters

  • Description:PCIE SWITCH GEN4 X36 PSX 753BBGA
  • Series:Switchtec
  • Mfr:Microchip Technology
  • Package:Tray
  • Applications:Controller
  • Interface:JTAG, MII, RMII, UART, 2-Wire SMBus
  • Voltage - Supply:-
  • Package / Case:753-BBGA
  • Supplier Device Package:753-BBGA (29x29)
  • Grade:-
  • Qualification:-
  • Mounting Type:Surface Mount

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PM41036B1-F3EI

Overview

The PM41036B1-F3EI is a PCIe Gen4 switch integrated circuit manufactured by Microchip Technology. It provides a x36 lane configuration, facilitating high-bandwidth data transfer for demanding applications. The component is housed in a 753-ball Ball Grid Array (BBGA) package, specifically identified as PSX 753BBGA. This streamlined 29x29 module design enables seamless integration into complex electronic systems requiring robust interconnectivity and signal integrity.

Feature Summary

  • Supports PCIe Generation 4 interface standards for enhanced data throughput
  • Features a x36 lane switching architecture for extensive connectivity
  • Utilizes a 753-ball BBGA package for compact board integration

Applications

  • Embedded communication systems
  • Wireless gateway applications
  • High-performance networking infrastructure

Procurement Notes

Verify the specific ordering suffix F3EI against official Microchip documentation to confirm pinout and electrical characteristics. Ensure compatibility with the required 753BBGA footprint during PCB layout. Cross-reference the manufacturer part number with authorized distributors to avoid counterfeit components. Confirm that the source material explicitly supports the stated specifications before finalizing procurement decisions.

Selection Notes

Select this component when a high-density PCIe Gen4 switch solution is required for embedded environments. The 753BBGA package necessitates specialized surface-mount assembly processes. Evaluate thermal management requirements associated with the dense interconnect topology. Ensure the host system design accommodates the specific mechanical dimensions of the 29x29 module form factor.

Part Context

This device belongs to Microchip Technology's portfolio of networking processors designed for embedded communication. It addresses the need for stable operation and sufficient performance in wireless gateway and similar applications. The product line focuses on providing reliable interconnectivity solutions for critical infrastructure components within broader electronic systems.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Verify if other variants within the same family share identical pinouts or electrical parameters before considering alternatives.

PM41036B1-F3EIPM41036B1-F3EI

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