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PMEG150G30ELP-QX is listed in the Single Diodes range at ChipApex. The manufacturer field lists Nexperia USA Inc.. Its product description is DIODE SIGE 150V 3A SOD128/CFP5. Review the specifications below when checking this part for your BOM.
The PMEG150G30ELP-QX is a Schottky rectifier manufactured by Nexperia USA Inc. It features a maximum repetitive reverse voltage of 150 V and an average forward current rating of 3 A. The device utilizes a CFP5 (SOD-128) surface-mount package with two pins. Key electrical characteristics include a maximum forward voltage of 850 mV at the rated current and a maximum reverse leakage current of 300 nA at 150 V. The component operates within a junction temperature range of -55 °C to +150 °C and holds AEC-Q101 automotive qualification.
Verify the specific suffix 'QX' against the manufacturer's official documentation to confirm AEC-Q101 automotive qualification status. Ensure the ordering part number matches the exact package variant required for your PCB footprint. Cross-reference the datasheet revision date to validate technical specifications before finalizing procurement orders.
Select this component when designing circuits requiring high-voltage blocking capability up to 150 V combined with moderate current handling of 3 A. The low forward voltage characteristic makes it suitable for applications prioritizing efficiency over ultra-low leakage. Confirm that the thermal management strategy supports the specified maximum junction temperature limits during operation.
This device belongs to the PMEG series of Schottky rectifiers from Nexperia, designed specifically for automotive and industrial applications. The series emphasizes reliability and efficiency through advanced semiconductor processes. The PMEG150G30ELP-QX represents a high-voltage option within this lineup, offering a balance of voltage rating and current capacity for power conversion tasks.
Consult official Nexperia substitution guides for verified equivalents. Generic replacements may not match the AEC-Q101 qualification or specific package dimensions. Verify pinout compatibility and thermal characteristics before integrating alternative components into existing designs.
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