SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The PMEG2020CPAS is a planar Schottky barrier rectifier in a common cathode configuration, featuring an integrated guard ring for stress protection. It is encapsulated in an ultra-thin DFN2020D-3 (SOT1061D) leadless SMD plastic package with visible and solderable side pads. The device supports an average forward current of 2 A and a reverse voltage of 20 V per diode. Forward voltage is typically 385 mV at 2 A, with a maximum of 420 mV. Reverse current is typically 380 µA at 20 V.
Verify the specific ordering suffix to confirm automotive qualification status, as standard versions may differ from qualified variants. Ensure the procurement documentation matches the exact part number PMEG2020CPAS to avoid confusion with non-automotive or alternative package types. Cross-reference the datasheet revision date against manufacturing lot codes to ensure compliance with the latest product specifications and legal disclaimers provided by Nexperia.
Select this component for designs requiring compact footprint solutions due to its small DFN2020D-3 package dimensions. Consider the exposed cathode pad for thermal management requirements in high-current applications. Evaluate the low forward voltage drop for efficiency-critical low-voltage power paths. Confirm that the 20 V reverse voltage rating aligns with the peak inverse voltage present in the target circuit topology.
This dual Schottky barrier rectifier belongs to Nexperia's PMEG series of low VF devices. It utilizes a planar technology structure designed for robust performance in surface-mount applications. The common cathode configuration allows for independent control of two diodes within a single compact package, facilitating space-constrained circuit layouts while maintaining reliable switching characteristics.
Consult official Nexperia documentation for confirmed substitute part numbers. Verify pinout compatibility and thermal resistance values when replacing existing components in established designs.
The device is housed in a DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device plastic package with visible and solderable side pads.
According to the datasheet revision history, this specific product data sheet indicates the product has been changed to non-automotive qualification. Automotive qualified alternatives are available separately.
The device features an exposed heat sink cathode pad that provides excellent thermal and electrical conductivity, aiding in heat dissipation from the junction to the PCB.