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The Nexperia PNE20080CPE is a dual common cathode hyperfast recovery rectifier featuring high power density and planar technology. It operates with a reverse voltage of 200 V and supports an average forward current of 4 A per diode. The device exhibits a maximum reverse recovery time of 30 ns, enabling efficient hyperfast switching. Encapsulated in a CFP15B (SOT1289B) package, it measures 5.8 x 4.3 mm with a typical height of 0.95 mm. Key electrical parameters include a forward voltage of up to 930 mV at 4 A and a junction temperature range of -55 °C to 175 °C.
Verify the specific part number PNE20080CPE against official Nexperia documentation to confirm the CFP15B package and 200 V rating. Ensure compatibility with standard SMD reflow soldering processes using the provided footprint guidelines. Confirm that the application requirements align with the non-automotive qualification status unless explicitly stated otherwise in updated product data.
Select this component for designs requiring dual common cathode configurations with fast recovery characteristics. The 4 A per diode rating and 200 V reverse voltage support moderate power levels. Consider the thermal resistance values when designing heat dissipation strategies on FR4 PCBs. The ultra-thin package profile is advantageous for space-constrained surface-mount layouts.
This device belongs to Nexperia's hyperfast recovery rectifier family, utilizing planar technology for improved efficiency. It is designed as a Surface-Mounted Device in a plastic package, distinct from through-hole alternatives. The dual common cathode structure allows for use in bridge rectifier or synchronous rectification topologies within compact form factors.
Consult official Nexperia substitution guides for verified equivalents. Cross-reference pinout and thermal characteristics when replacing similar dual common cathode rectifiers in existing designs.
The maximum reverse recovery time (trr) is specified as 30 ns under defined test conditions.
It is encapsulated in a CFP15B (SOT1289B) power and flat lead Surface-Mounted Device plastic package with three leads.
The typical thermal resistance from junction to solder point (Rth(j-sp)) is 7 K/W.