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The Powerex PP100T060 is a POW-R-PAK three-phase IGBT assembly rated for 100A continuous collector current and 400V DC bus voltage. It integrates F-series trench gate IGBTs with low conduction and switching losses, mounted on a forced-air cooled heatsink. The unit includes an integrated gate drive board with isolated power supplies, optically isolated interfaces, and a 18000 µF DC-link capacitor bank. Key electrical parameters include a 100A continuous collector current, 200A peak current, and 350W maximum collector dissipation at Tj < 150°C. Thermal resistance from junction to case is typically 0.23 °C/W per IGBT.
Verify the specific datasheet revision and configuration options before procurement, as the POW-R-PAK series allows for configurable assembly types. Confirm that the required mounting torque specifications are met during installation to ensure proper thermal contact and mechanical stability. Ensure the cooling system provides the specified 1500 LFM airflow to maintain safe operating temperatures within the -25°C to +85°C range.
Select this assembly for applications requiring a complete, pre-integrated three-phase inverter solution with built-in protection. It is suitable for designs needing operation above 20kHz switching frequencies with DC bus voltages up to 400VDC. Consider the weight of 21 lbs and the requirement for forced air cooling when designing the enclosure. Verify compatibility with the recommended 3M mating connectors for the gate drive interface.
This component belongs to the Powerex POW-R-PAK family of configurable IGBT-based power assemblies. These modules are designed to simplify the integration of high-power semiconductor devices by combining the IGBT bridge, gate drive electronics, and passive components into a single unit. This approach reduces design complexity and improves reliability compared to discrete component implementations.
No direct public substitute part numbers are documented for this specific integrated assembly model. Replacement requires evaluating equivalent three-phase IGBT modules with compatible voltage and current ratings, while separately sourcing or designing the necessary gate drive and protection circuitry.
The module is suitable for operation with DC bus voltages up to 400VDC.
It features superior short circuit detection and shoot-through prevention mechanisms integrated into the gate drive board, which can trigger fault outputs via open collector signals.
The power assembly must be mounted on a forced-air-cooled heatsink, specifically requiring 1500 LFM airflow to achieve the specified thermal performance.